US Patent Application 18316962. Embedded Packaging Concepts for Integration of ASICs and Optical Components simplified abstract

Embedded Packaging Concepts for Integration of ASICs and Optical Components

Organization Name

Apple Inc.

Inventor(s)

Kishore N. Renjan of Singapore (SG)

Bilal Mohamed Ibrahim Kani of Singapore (SG)

Kyusang Kim of Singapore (SG)

Manoj Vadeentavida of Singapore (SG)

Pierpaolo Lupo of Singapore (SG)

Prashanth S. Holenarsipur of Los Altos CA (US)

Praveesh Chandran of Singapore (SG)

Vinodh Babu of Singapore (SG)

Yuta Kuboyama of San Mateo CA (US)

Embedded Packaging Concepts for Integration of ASICs and Optical Components - A simplified explanation of the abstract

This abstract first appeared for US patent application 18316962 titled 'Embedded Packaging Concepts for Integration of ASICs and Optical Components

Simplified Explanation

The abstract describes optical packages and fabrication methods for embedding a controller chip, photodetector, and emitters in a single package.

• The patent application focuses on optical packages and their fabrication methods.
• The package includes a controller chip, a photodetector (PD), and one or more emitters.
• The controller chip, PD, and emitters are embedded together in a single package.
• The purpose of this innovation is to integrate various optical components into a compact package.
• The embedded controller chip allows for efficient control and coordination of the optical components.
• The photodetector is used to detect light signals, while the emitters are responsible for emitting light.
• The single package design simplifies the overall optical system and reduces the need for separate components.
• The fabrication methods described in the patent application enable the efficient production of these optical packages.

Original Abstract Submitted

Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.