US Patent Application 18069318. SEMICONDUCTOR PACKAGE simplified abstract

SEMICONDUCTOR PACKAGE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.==Inventor(s)==

[[Category:YeongBeom Ko of Suwon-si (KR)]]

[[Category:Junyun Kweon of Suwon-si (KR)]]

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18069318 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The abstract describes a semiconductor package that includes a semiconductor module on a substrate.

• The semiconductor module consists of a first semiconductor chip with two surfaces, a second semiconductor chip, conductive pillars, and a redistribution substrate.
• The conductive pillars are connected to the first surface of the first semiconductor chip and the third surface of the redistribution substrate.
• The redistribution substrate is also connected to the second semiconductor chip.
• The fourth surface of the redistribution substrate is connected to the substrate of the semiconductor package.
• This design allows for efficient electrical connections between the semiconductor chips and the substrate.

Original Abstract Submitted

A semiconductor package includes at least one semiconductor module on a substrate. The semiconductor module includes a first semiconductor chip having a first surface and a second surface opposite to the first surface, a second semiconductor chip on the first surface, a plurality of conductive pillars on the first surface, and a redistribution substrate on the second semiconductor chip and the plurality of conductive pillars. The redistribution substrate has a third surface and a fourth surface opposite to the third surface. The third surface of the redistribution substrate faces the first surface of the first semiconductor chip, the plurality of conductive pillars are electrically connected to the first surface of the first semiconductor chip and the third surface of the redistribution substrate, and the fourth surface of the redistribution substrate is electrically connected to the substrate of the semiconductor package.