PACKAGE STRUCTURE

The abstract describes a package structure for an electronic device, including a semiconductor die, a redistribution circuit structure, and an insulating encapsulation. The redistribution circuit structure consists of colored dielectric layers, inter-dielectric layers, and redistribution conductive layers. The electronic device is connected to the redistribution circuit structure.

Semiconductor die enclosed by insulating encapsulation
Redistribution circuit structure on semiconductor die and encapsulation
Redistribution circuit structure includes colored dielectric layer, inter-dielectric layers, and redistribution conductive layers
Electronic device connected to redistribution circuit structure

Potential Applications

This technology could be applied in various electronic devices requiring compact and efficient packaging solutions.

Problems Solved

This innovation solves the problem of efficiently encapsulating and connecting semiconductor dies in electronic devices.

Benefits

The benefits of this technology include improved reliability, compact design, and enhanced performance of electronic devices.

Potential Commercial Applications

The potential commercial applications of this technology include consumer electronics, medical devices, automotive electronics, and more.

Possible Prior Art

Prior art may include existing packaging structures for semiconductor dies in electronic devices, but this specific combination of features may be novel.

Unanswered Questions

How does the colored dielectric layer impact the performance of the electronic device?

The abstract does not provide specific details on the role or impact of the colored dielectric layer on the performance of the electronic device.

What materials are used in the inter-dielectric layers?

The abstract does not mention the specific materials used in the inter-dielectric layers of the redistribution circuit structure.

Original Abstract Submitted

a package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. the semiconductor die is laterally encapsulated by an insulating encapsulation. the redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. the redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. the electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Taiwan semiconductor manufacturing co., ltd. (20240096781). PACKAGE STRUCTURE simplified abstract

Contents

PACKAGE STRUCTURE

Organization Name

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