US Patent Application 18358714. CHIP PACKAGE STRUCTURE simplified abstract
Contents
CHIP PACKAGE STRUCTURE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Shin-Puu Jeng of Po-Shan Village (TW)
Shuo-Mao Chen of New Taipei City (TW)
Feng-Cheng Hsu of New Taipei City (TW)
Po-Yao Lin of Zhudong Township (TW)
CHIP PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18358714 titled 'CHIP PACKAGE STRUCTURE
Simplified Explanation
The abstract describes a chip package structure that includes a redistribution structure with a first surface and a second surface. The structure has a first pad adjacent to the first surface and a second pad adjacent to and exposed from the second surface. A chip package is bonded to the first pad through a first bump, and the first pad and second pad decrease in width in a first direction away from the chip package. There is also a second bump over the second pad.
- Chip package structure with a redistribution structure
- First pad adjacent to the first surface and second pad adjacent to the second surface
- Chip package bonded to the first pad through a first bump
- Width of the first pad decreases in a first direction away from the chip package
- Width of the second pad also decreases in the first direction
- Second bump over the second pad
Original Abstract Submitted
A chip package structure is provided. The chip package structure includes a first redistribution structure having a first surface and a second surface. The first redistribution structure includes a first pad and a second pad, the first pad is adjacent to the first surface, and the second pad is adjacent to and exposed from the second surface. The chip package structure includes a chip package bonded to the first pad through a first bump, wherein a first width of the first pad decreases in a first direction away from the chip package, and a second width of the second pad decreases in the first direction. The chip package structure includes a second bump over the second pad.
