Qualcomm incorporated (20240105687). PACKAGE COMPRISING A FLEXIBLE SUBSTRATE simplified abstract

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PACKAGE COMPRISING A FLEXIBLE SUBSTRATE

Organization Name

qualcomm incorporated

Inventor(s)

Joan Rey Villarba Buot of Escondido CA (US)

Hong Bok We of San Diego CA (US)

Zhijie Wang of San Diego CA (US)

Aniket Patil of San Diego CA (US)

PACKAGE COMPRISING A FLEXIBLE SUBSTRATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240105687 titled 'PACKAGE COMPRISING A FLEXIBLE SUBSTRATE

Simplified Explanation

The abstract describes a patent application for a package that includes a substrate with integrated devices coupled to its surface, with the back sides of the devices connected through an adhesive. The substrate has a flexible portion that allows it to bend, bringing the back sides of the devices together in the package.

  • The package comprises a substrate with integrated devices coupled to its surface.
  • The back sides of the integrated devices are connected through an adhesive.
  • The substrate includes a flexible portion that allows it to bend.
  • The flexible portion brings the back sides of the integrated devices together in the package.

Potential Applications

The technology described in this patent application could be applied in the following areas:

  • Flexible electronics
  • Wearable devices
  • Biomedical devices

Problems Solved

This technology solves the following problems:

  • Facilitates the integration of multiple devices in a compact package
  • Enables flexibility in electronic devices
  • Improves the durability of electronic components

Benefits

The benefits of this technology include:

  • Enhanced flexibility in device design
  • Increased reliability in device packaging
  • Improved performance in compact electronic systems

Potential Commercial Applications

The potential commercial applications of this technology could include:

  • Flexible displays
  • Smart clothing
  • Medical implants

Possible Prior Art

One possible prior art for this technology could be the development of flexible substrates for electronic devices in the field of wearable technology.

Unanswered Questions

How does the adhesive used in the package affect the overall durability of the integrated devices?

The article does not provide specific details on the type of adhesive used or its impact on the durability of the devices.

What are the specific materials used in the substrate and integrated devices to enable flexibility?

The article does not delve into the specific materials used in the construction of the substrate and integrated devices to achieve flexibility.


Original Abstract Submitted

a package comprising a substrate, a first integrated device coupled to a first surface of the substrate, and a second integrated device coupled to the first surface of the substrate; wherein a back side of the second integrated device is coupled to a back side of the first integrated device through an adhesive. the substrate includes at least one dielectric layer and a plurality of interconnects. the substrate includes a flexible portion that is configured to be bend such that the back side of the first integrated device faces the back side of the second integrated device in the package.

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