US Patent Application 17825350. INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING RETICLE BOUNDARY / DICING STREETS OF MONOLITHIC STRUCTURES THEREIN simplified abstract

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INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING RETICLE BOUNDARY / DICING STREETS OF MONOLITHIC STRUCTURES THEREIN

Organization Name

Intel Corporation

Inventor(s)

Debendra Mallik of Chandler AZ (US)

Nitin Deshpande of Chandler AZ (US)

Satish Damaraju of El Dorado Hills CA (US)

Scott Siers of Elk Grove CA (US)

Kai-Chiang Wu of Hsinchu City (TW)

INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING RETICLE BOUNDARY / DICING STREETS OF MONOLITHIC STRUCTURES THEREIN - A simplified explanation of the abstract

This abstract first appeared for US patent application 17825350 titled 'INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING RETICLE BOUNDARY / DICING STREETS OF MONOLITHIC STRUCTURES THEREIN

Simplified Explanation

The abstract describes an integrated circuit assembly that consists of two levels of structures.

  • The first level structure includes a monolithic substrate with two reticle zones, each containing integrated circuitry.
  • The second level structure consists of at least one integrated circuit device that is electrically attached to the integrated circuitry in the first reticle zone of the first level structure.
  • A bridge is used to electrically connect the integrated circuitry in the first reticle zone of the first level structure with the integrated circuitry in the second reticle zone of the first level structure.


Original Abstract Submitted

An integrated circuit assembly may be formed having a first level structure that comprises a monolithic substrate with a first reticle zone including integrated circuitry and a second reticle zone including integrated circuitry, and a second level structure comprising at least one integrated circuit device electrically attached to the integrated circuitry of the first reticle zone of the first level structure and a bridge electrically attaching the integrated circuitry of the first reticle zone of the first level structure and the integrated circuitry of the second reticle zone of the first level structure.

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