SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHOD THEREOF

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240096849 titled 'SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The semiconductor structure described in the patent application includes a semiconductor die, a redistribution circuit structure, and a terminal. The redistribution circuit structure is located on and connected to the semiconductor die, while the terminal is located on and connected to the redistribution circuit structure. The terminal consists of an under-bump metallization (UBM) and a capping layer, with the UBM having a recess that is filled by the capping layer.

Semiconductor structure with redistribution circuit and terminal:

   * Semiconductor die
   * Redistribution circuit structure
   * Terminal

Terminal components:

   * Under-bump metallization (UBM)
   * Capping layer
   * UBM recess filled by capping layer

Potential Applications

The technology described in this patent application could be applied in the following areas:

Semiconductor manufacturing
Integrated circuit packaging
Electronic device production

Problems Solved

The innovation addresses the following issues:

Improving electrical coupling in semiconductor structures
Enhancing reliability of terminal connections
Optimizing space utilization in electronic components

Benefits

The technology offers the following benefits:

Increased performance of semiconductor devices
Enhanced durability of electronic components
Streamlined manufacturing processes

Potential Commercial Applications

The semiconductor structure innovation could be utilized in various commercial applications, including:

Consumer electronics
Automotive electronics
Telecommunications equipment

Possible Prior Art

One possible prior art related to this technology is the use of UBM and capping layers in semiconductor packaging to improve electrical connections and protect components.

Unanswered Questions

How does this technology compare to existing semiconductor packaging methods?

The article does not provide a direct comparison between this technology and traditional semiconductor packaging methods. It would be beneficial to understand the specific advantages and disadvantages of this innovation in comparison to existing techniques.

What are the potential limitations or challenges in implementing this semiconductor structure in mass production?

The article does not address any potential limitations or challenges that may arise when implementing this technology on a large scale. It would be important to explore any obstacles that could affect the widespread adoption of this innovation.

Original Abstract Submitted

a semiconductor structure includes a semiconductor die, a redistribution circuit structure, and a terminal. the redistribution circuit structure is disposed on and electrically coupled to the semiconductor die. the terminal is disposed on and electrically coupled to the redistribution circuit structure, where the redistribution circuit structure is disposed between the semiconductor die and the terminal, and the terminal includes an under-bump metallization (ubm) and a capping layer. the ubm is disposed on and electrically coupled to the redistribution circuit structure, where the ubm includes a recess. the capping layer is disposed on and electrically coupled to the ubm, where the ubm is between the capping layer and the redistribution circuit structure, and the capping layer fills the recess of the ubm.

Taiwan semiconductor manufacturing co., ltd. (20240096849). SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHOD THEREOF simplified abstract

Contents

SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHOD THEREOF

Organization Name

Inventor(s)