US Patent Application 17825340. INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING INTEGRATED CIRCUIT DEVICES THEREIN simplified abstract

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INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING INTEGRATED CIRCUIT DEVICES THEREIN

Organization Name

Intel Corporation

Inventor(s)

Kai-Chiang Wu of Zhubei City (TW)

Han-wen Lin of Zhubei City (TW)

INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING INTEGRATED CIRCUIT DEVICES THEREIN - A simplified explanation of the abstract

This abstract first appeared for US patent application 17825340 titled 'INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING INTEGRATED CIRCUIT DEVICES THEREIN

Simplified Explanation

The abstract describes an integrated circuit assembly that includes a bridge connecting two integrated circuit devices in different levels of the assembly.

  • The integrated circuit assembly has a bridge incorporated into one level structure.
  • The bridge electrically interconnects at least two integrated circuit devices in another level structure.
  • The assembly includes a first level structure with a first and second integrated circuit device.
  • A second level structure is attached to the first integrated circuit device and the bridge forms an electrical attachment between the first and second integrated circuit devices.


Original Abstract Submitted

An integrated circuit assembly may be formed with a bridge incorporated into at least one level structure of the integrated circuit assembly, which electrically interconnects at least two integrated circuit devices in another level structure of the integrated circuit assembly. In one example, the integrated circuit assembly may include a first level structure that comprises at least a first integrated circuit device and a second integrated circuit device, and a second level structure comprising at least one integrated circuit device electrically attached to the first integrated circuit device of the first level structure and the bridge forming an electrical attachment between the first integrated circuit device of the first level structure and the second integrated circuit device of the first level structure.

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