US Patent Application 18303693. SEMICONDUCTOR PACKAGE simplified abstract

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SEMICONDUCTOR PACKAGE

Organization Name

MEDIATEK INC.

Inventor(s)

Yi-Lin Tsai of Hsinchu City (TW)

Wen-Sung Hsu of Hsinchu City (TW)

Nai-Wei Liu of Hsinchu City (TW)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18303693 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The patent application describes a semiconductor package that includes multiple semiconductor structures on an interposer over a substrate.

  • The package includes interconnect traces, a redistribution structure, and three semiconductor structures.
  • The first semiconductor structure consists of a semiconductor die and an encapsulant that surrounds it.
  • The second semiconductor structure also consists of a semiconductor die and an encapsulant.
  • The third semiconductor structure is located near a corner or edge of the substrate and includes a semiconductor die and an encapsulant.
  • The third semiconductor structure is electrically insulated from the substrate and the other semiconductor structures.


Original Abstract Submitted

A semiconductor package includes an interposer over a substrate that includes interconnect traces, a redistribution structure on the interposer, a first semiconductor structure, a second semiconductor structure and a third semiconductor structure on the redistribution structure. The first semiconductor structure includes a first semiconductor die and a first encapsulant that encapsulates the first semiconductor die. The second semiconductor structure includes a second semiconductor die and a second encapsulant that encapsulates the second semiconductor die. The third semiconductor structure is disposed adjacent to a corner or an edge of the substrate in a top plan view of the substrate. The third semiconductor structure includes a third semiconductor die and a third encapsulant that encapsulates the third semiconductor die. The third semiconductor structure is electrically insulated from the substrate, the first semiconductor structure and the second semiconductor structure.

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