International business machines corporation (20240112965). TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE
Organization Name
international business machines corporation
Inventor(s)
Chinami Marushima of Urayasu-city (JP)
Toyohiro Aoki of Yokohama (JP)
Takashi Hisada of Hachiouji-shi (JP)
Marc A. Bergendahl of Rensselaer NY (US)
TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240112965 titled 'TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE
Simplified Explanation
A semiconductor device described in the patent application includes a substrate with a cavity and a trench extended from the cavity. The device also includes a first chip, a second chip, and a bridge chip interconnecting between the first and second chips, residing in the cavity. Underfill material fills the cavity and the trench, surrounding the bridge chip.
- The semiconductor device includes a substrate with a cavity and a trench, providing a unique structure for chip interconnection.
- The bridge chip interconnects between the first and second chips, enhancing the functionality and performance of the semiconductor device.
- Underfill material fills the cavity and the trench, providing structural support and protection for the bridge chip and the overall device.
Potential Applications
The technology described in the patent application could be applied in:
- Integrated circuits
- Microprocessors
- Memory devices
Problems Solved
The semiconductor device addresses the following issues:
- Chip interconnection in a compact space
- Structural support and protection for interconnecting chips
Benefits
The semiconductor device offers the following benefits:
- Enhanced functionality and performance
- Improved structural integrity and reliability
- Compact design for space-saving applications
Potential Commercial Applications
The technology could be utilized in various commercial applications, including:
- Consumer electronics
- Telecommunications
- Automotive industry
Possible Prior Art
Prior art related to chip interconnection and underfill materials in semiconductor devices may exist, but specific examples are not provided in the patent application.
Unanswered Questions
How does the underfill material impact the thermal performance of the semiconductor device?
The patent application does not provide information on the thermal properties of the underfill material and its effect on the overall thermal performance of the device.
What are the specific materials used for the bridge chip and underfill material in the semiconductor device?
The patent application does not disclose the exact materials utilized for the bridge chip and underfill material, leaving room for further investigation into the composition and properties of these components.
Original Abstract Submitted
a semiconductor device includes a substrate, which further includes a cavity and a trench extended from the cavity. the semiconductor includes a first chip and a second chip on the substrate, a bridge chip interconnecting between the first and second chips and residing in the cavity, and underfill material filling the cavity and the trench, and surrounding the bridge chip.
