US Patent Application 18346319. Integrated Circuit Package and Method Forming Same simplified abstract

Integrated Circuit Package and Method Forming Same

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Shin-Puu Jeng of Hsinchu (TW)

Shuo-Mao Chen of New Taipei City (TW)

Feng-Cheng Hsu of New Taipei (TW)

Integrated Circuit Package and Method Forming Same - A simplified explanation of the abstract

This abstract first appeared for US patent application 18346319 titled 'Integrated Circuit Package and Method Forming Same

Simplified Explanation

The patent application describes a method for bonding different components of a package together using an interposer.

• The method involves bonding a core device die and a memory die to the interposer.
• An Independent Passive Device (IPD) die is directly bonded to the interposer.
• The IPD die is connected to the core device die through a conductive path in the interposer.
• A package substrate is bonded to the interposer on the opposite side of the core device die and memory die.

Original Abstract Submitted

A method includes bonding a first package component and a second package component to an interposer. The first package component includes a core device die, and the second package component includes a memory die. An Independent Passive Device (IPD) die is bonded directly to the interposer. The IPD die is electrically connected to the first package component through a first conductive path in the interposer. A package substrate is bonded to the interposer die. The package substrate is on an opposing side of the interposer than the first package component and the second package component.