Qualcomm incorporated (20240105688). PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION simplified abstract
Contents
- 1 PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION
Organization Name
Inventor(s)
Xuefeng Zhang of San Diego CA (US)
Aniket Patil of San Diego CA (US)
PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105688 titled 'PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION
Simplified Explanation
The abstract describes a patent application for a package that includes a substrate with interconnects, two chiplets, an encapsulation layer with encapsulation interconnects, a metallization portion, and a first integrated device.
- The package comprises a substrate with at least one dielectric layer and interconnects.
- A first chiplet is connected to the substrate, with a second chiplet connected to the first chiplet.
- An encapsulation layer covers the substrate, first chiplet, and second chiplet, with encapsulation interconnects within.
- A metallization portion is connected to the encapsulation layer, second chiplet, and encapsulation interconnects.
- A first integrated device is connected to the metallization portion.
Potential Applications
This technology can be applied in the semiconductor industry for advanced packaging solutions, such as in high-performance computing, telecommunications, and consumer electronics.
Problems Solved
This technology solves the challenges of integrating multiple chiplets in a compact package while maintaining efficient interconnectivity and thermal management.
Benefits
The benefits of this technology include improved performance, reduced footprint, enhanced reliability, and simplified assembly processes for electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology include system-on-chip designs, IoT devices, data centers, and mobile devices.
Possible Prior Art
Prior art in the field of semiconductor packaging includes traditional wire bonding, flip-chip technology, and 3D stacking techniques.
Unanswered Questions
How does this technology compare to existing packaging solutions in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of this technology compared to existing packaging solutions.
What are the environmental implications of using this technology in electronic devices?
This article does not address the environmental implications of using this technology in electronic devices.
Original Abstract Submitted
a package comprising a substrate comprising at least one dielectric layer and a plurality of interconnects, a first chiplet coupled to the substrate, a second chiplet coupled to the first chiplet, an encapsulation layer coupled to the substrate, the first chiplet and the second chiplet, a plurality of encapsulation interconnects located in the encapsulation layer, a metallization portion coupled to the encapsulation layer, the second chiplet and the plurality of encapsulation interconnects and a first integrated device coupled to the metallization portion.
