Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract

PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS

Organization Name

intel corporation

Inventor(s)

Brandon C. Marin of Gilbert AZ (US)

Kristof Kuwawi Darmawikarta of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Jeremy Ecton of Gilbert AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Hiroki Tanaka of Gilbert AZ (US)

PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128247 titled 'PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS

Simplified Explanation

The patent application describes a microelectronic assembly that includes a first substrate with glass and at least one inductor, a second substrate coupled to the first substrate, and a plurality of integrated circuit (IC) dies. The IC dies are divided into subsets, with some directly coupled to the first substrate, some directly coupled to the second substrate, and some embedded in the second substrate between the first substrate and the second subset of IC dies.

• First substrate with glass and at least one inductor
• Second substrate coupled to the first substrate
• Plurality of IC dies divided into subsets
• Some IC dies directly coupled to the first substrate
• Some IC dies directly coupled to the second substrate
• Some IC dies embedded in the second substrate between the first substrate and the second subset of IC dies

Potential Applications

The technology described in the patent application could be applied in:

• Microelectronics manufacturing
• Circuit board design
• Electronic device production

Problems Solved

This technology helps in:

• Improving integration of IC dies
• Enhancing performance of microelectronic assemblies
• Facilitating compact design of electronic devices

Benefits

The benefits of this technology include:

• Increased efficiency in microelectronic assembly
• Enhanced functionality of integrated circuits
• Reduction in space requirements for electronic components

Potential Commercial Applications

The potential commercial applications of this technology could be in:

• Consumer electronics
• Automotive electronics
• Aerospace industry

Possible Prior Art

One possible prior art for this technology could be the use of embedded IC dies in substrates for microelectronic assemblies.

Unanswered Questions

How does this technology impact the overall cost of microelectronic assembly production?

The article does not provide information on the cost implications of implementing this technology in microelectronic assembly production.

What are the specific performance improvements achieved by embedding IC dies in the second substrate?

The article does not detail the specific performance enhancements resulting from embedding IC dies in the second substrate.

Original Abstract Submitted

embodiments described herein enable a microelectronic assembly that includes: a first substrate comprising glass and at least one inductor, the first substrate having a first side and an opposing second side; a second substrate coupled to the first side of the first substrate; and a plurality of integrated circuit (ic) dies. a first subset of the plurality of ic dies is directly coupled to the second side of the first substrate, a second subset of the plurality of ic dies is directly coupled to the second substrate adjacent to the first substrate, and a third subset of the plurality of ic dies is embedded in the second substrate between the first substrate and the second subset of the plurality of ic dies.