Samsung electronics co., ltd. (20240096851). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Unbyoung Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096851 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor package described in the abstract includes a complex structure involving multiple semiconductor chips, redistribution structures, vertical connection wires, and a molding layer. The package is designed to enable efficient communication and connection between the various components within the package.
- The semiconductor package includes a first redistribution structure, a first semiconductor chip with a through-electrode, a second semiconductor chip vertically overlapping the first chip, a molding layer, a second redistribution structure, and vertical connection wires.
- The second semiconductor chip is positioned in a way that its central portion overlaps with the first chip, while the outer portion is offset from the sidewall of the first chip.
- The vertical connection wires extend through the molding layer, connecting the first redistribution structure to both the second redistribution structure and the outer portion of the second semiconductor chip.
Potential Applications
This technology could be applied in advanced electronic devices such as smartphones, tablets, and laptops to improve performance and connectivity.
Problems Solved
This technology solves the problem of efficiently connecting multiple semiconductor chips within a compact package, enabling enhanced functionality and performance.
Benefits
The benefits of this technology include improved communication between semiconductor chips, increased efficiency, and potentially reduced size of electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology could be in the consumer electronics industry, particularly in the development of high-performance devices.
Possible Prior Art
One possible prior art for this technology could be the use of stacked semiconductor chips in electronic devices to improve performance and functionality.
Unanswered Questions
How does this technology impact the overall cost of electronic devices?
This technology could potentially increase the cost of electronic devices due to the complexity of the semiconductor package and the additional components involved. However, the improved performance and functionality may justify the higher cost for some consumers.
What are the potential challenges in manufacturing semiconductor packages with such complex structures?
Manufacturing semiconductor packages with multiple chips and intricate connection structures may pose challenges in terms of precision, reliability, and yield rates. Ensuring the quality and consistency of these packages could be a significant hurdle for manufacturers.
Original Abstract Submitted
a semiconductor package includes a first redistribution structure, a first semiconductor chip on the first redistribution structure and including a first through-electrode, a second semiconductor chip on the first semiconductor chip and including a central portion vertically overlapping the first semiconductor chip and an outer portion horizontally offset from a sidewall of the first semiconductor chip, a molding layer in contact with the first redistribution structure, the first semiconductor chip, and the second semiconductor chip, a second redistribution structure on the second semiconductor chip and the molding layer, a first vertical connection wire extending through the molding layer and extending from the first redistribution structure to the second redistribution structure, and a second vertical connection wire extending through the molding layer and extending from the first redistribution structure to the outer portion of the second semiconductor chip.
