Taiwan semiconductor manufacturing co., ltd. (20240096837). PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Tsung-Shu Lin of New Taipei City (TW)
Hsuan-Ning Shih of Taoyuan City (TW)
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096837 titled 'PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The patent application describes a package structure comprising a semiconductor die, a redistribution circuit structure, and conductive pads. The redistribution circuit structure is electrically connected to the semiconductor die and includes contact pads of different widths. The conductive pads are connected to the redistribution circuit structure through the contact pads, with the first contact pad being narrower than the conductive pads and the second contact pad being equal to or wider than the conductive pads.
- Semiconductor die, redistribution circuit structure, and conductive pads make up the package structure.
- Redistribution circuit structure connects to the semiconductor die and has contact pads of varying widths.
- Conductive pads are linked to the redistribution circuit structure through the contact pads.
- First contact pad is narrower than the conductive pads, while the second contact pad is equal to or wider than the conductive pads.
Potential Applications
The technology described in the patent application could be applied in the following areas:
- Semiconductor packaging
- Integrated circuits
- Electronic devices
Problems Solved
This technology addresses the following issues:
- Efficient electrical connection between semiconductor die and conductive pads
- Space optimization within the package structure
- Enhanced performance and reliability of electronic devices
Benefits
The benefits of this technology include:
- Improved signal transmission
- Enhanced thermal management
- Increased durability and longevity of electronic components
Potential Commercial Applications
The technology has potential commercial applications in:
- Consumer electronics
- Automotive industry
- Telecommunications sector
Possible Prior Art
One possible prior art for this technology could be the use of redistribution layers in semiconductor packaging to improve electrical connections and signal transmission.
Unanswered Questions
How does the width of the contact pads impact the overall performance of the package structure?
The width of the contact pads plays a crucial role in ensuring efficient electrical connection and signal transmission within the package structure.
What are the specific materials used in the fabrication of the conductive pads and redistribution circuit structure?
The materials used in the construction of these components can significantly impact the overall performance and reliability of the package structure.
Original Abstract Submitted
a package structure includes a semiconductor die, a redistribution circuit structure, and conductive pads. the redistribution circuit structure is located on and electrically connected to the semiconductor die, the redistribution circuit structure includes a first contact pad having a first width and a second contact pad having a second width. the conductive pads are located on and electrically connected to the redistribution circuit structure through connecting to the first contact pad and the second contact pad, the redistribution circuit structure is located between the conductive pads and the semiconductor die. the first width of the first contact pad is less than a width of the conductive pads, and the second width of the second contact pad is substantially equal to or greater than the width of the conductive pads.
