Taiwan semiconductor manufacturing co., ltd. (20240128232). SEMICONDUCTOR PACKAGE simplified abstract

SEMICONDUCTOR PACKAGE

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Tsung-Ding Wang of Tainan (TW)

Yen-Fu Su of Hsinchu (TW)

Hao-Cheng Hou of Hsinchu City (TW)

Jung-Wei Cheng of Hsinchu City (TW)

Chien-Hsun Lee of Hsin-chu County (TW)

Hsin-Yu Pan of Taipei (TW)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128232 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The semiconductor package described in the patent application includes a first semiconductor die with a conductive post, an encapsulant made of a first material, a high-modulus dielectric layer made of a second material, and a redistribution structure with a redistribution dielectric layer made of a third material. The protective layer is made of a fourth material, and the ratio of the Young's modulus of the second material to the fourth material is at least 1.5.

• First semiconductor die with conductive post and protective layer
• Encapsulant made of a first material
• High-modulus dielectric layer made of a second material
• Redistribution structure with redistribution dielectric layer made of a third material
• Protective layer made of a fourth material with specific Young's modulus ratio

Potential Applications

This technology could be applied in the manufacturing of advanced semiconductor packages for various electronic devices, such as smartphones, tablets, and computers.

Problems Solved

This innovation addresses the need for improved reliability and performance in semiconductor packaging by utilizing specific materials and structures to enhance the overall package quality.

Benefits

The use of high-modulus dielectric layers and specific material ratios can lead to increased durability, better thermal management, and overall improved functionality of semiconductor packages.

Potential Commercial Applications

The potential commercial applications of this technology include the semiconductor industry, electronics manufacturing companies, and any other businesses involved in producing advanced electronic devices.

Possible Prior Art

One possible prior art could be the use of different materials in semiconductor packaging to improve performance and reliability. However, the specific combination of materials and structures described in this patent application may be unique.

How does this technology compare to existing semiconductor packaging solutions in terms of cost-effectiveness?

The patent application does not provide information on the cost implications of implementing this technology compared to traditional semiconductor packaging methods.

What are the environmental impacts of using the specific materials mentioned in the patent application for semiconductor packaging?

The environmental sustainability aspect of the materials used in this technology is not addressed in the patent application.

Original Abstract Submitted

a semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. the first semiconductor die includes a conductive post in a protective layer. the encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. the high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. the redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. the protective layer is made of a fourth material, and a ratio of a young's modulus of the second material to a young's modulus of the fourth material is at least 1.5.