US Patent Application 18366282. Antenna Apparatus and Method simplified abstract
Contents
Antenna Apparatus and Method
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Feng-Wei Kuo of Zhudong Township (TW)
Wen-Shiang Liao of Toufen Township (TW)
Antenna Apparatus and Method - A simplified explanation of the abstract
This abstract first appeared for US patent application 18366282 titled 'Antenna Apparatus and Method
Simplified Explanation
The patent application describes a package structure that includes two dies and an insulating material.
- The first die is connected to the second die, and the second die is surrounded by the insulating material.
- The package structure also includes a first antenna that extends through the insulating material and is connected to the second die.
- The first antenna is located next to a sidewall of the second die.
- The first antenna consists of a conductive plate and multiple conductive pillars that extend through the insulating material.
- The conductive plate is positioned between the conductive pillars and the sidewall of the second die.
Original Abstract Submitted
A package structure includes a first die, a second die over and electrically connected to the first die, an insulating material around the second die, a first antenna extending through the insulating material and electrically connected to the second die, the first antenna being adjacent to a first sidewall of the second die, wherein the first antenna includes a first conductive plate extending through the insulating material, and a plurality of first conductive pillars extending through the insulating material, wherein the first conductive plate is between the plurality of first conductive pillars and the first sidewall of the second die.
