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Category:H01L23/522
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Pages in category "H01L23/522"
The following 158 pages are in this category, out of 635 total.
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- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 30th, 2024
- Sk hynix inc. (20240119996). MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE simplified abstract
- Sk hynix inc. (20240159823). SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT simplified abstract
- Sk hynix inc. (20240162149). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE simplified abstract
- Sk hynix inc. (20240178172). SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT simplified abstract
- Sk hynix inc. (20240179918). THREE-DIMENSIONAL SEMICONDUCTOR DEVICE HAVING A SUPPORT PATTERN IN CONTACT WITH A SIDE SURFACE OF A CONTACT PLUG simplified abstract
- SK hynix Inc. patent applications on April 11th, 2024
- SK hynix Inc. patent applications on May 16th, 2024
- SK hynix Inc. patent applications on May 30th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096647). HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096696). STRUCTURES WITH CONVEX CAVITY BOTTOMS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096712). INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096753). SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THROUGH VIA AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096784). EXTENDED VIA CONNECT FOR PIXEL ARRAY simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096787). SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096800). SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096803). DIAGONAL BACKSIDE POWER AND SIGNAL ROUTING FOR AN INTEGRATED CIRCUIT simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096865). SEMICONDUCTOR DEVICE, METHOD OF AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096929). METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING METAL INSULATOR METAL CAPACITOR simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240098960). COMPACT ELECTRICAL CONNECTION THAT CAN BE USED TO FORM AN SRAM CELL AND METHOD OF MAKING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240099149). MRAM DEVICE STRUCTURES AND METHODS OF FABRICATING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240159599). TEMPERATURE MONITORING DEVICE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162094). SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162142). DIAGONAL VIA MANUFACTURING METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162145). RESISTOR WITHIN A VIA simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162172). SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186180). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE DIELECTRIC LAYER HAVING AIR GAP simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186235). INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186238). TECHNIQUES TO INHIBIT DELAMINATION FROM FLOWABLE GAP-FILL DIELECTRIC simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186257). SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186312). STATIC RANDOM ACCESS MEMORY DEVICE simplified abstract
- Taiwan Semiconductor manufacturing Co., Ltd. patent applications on April 18th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on May 16th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240105591). INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105601). DEEP LINES AND SHALLOW LINES IN SIGNAL CONDUCTING PATHS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105619). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105629). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105849). SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105901). SEMICONDUCTOR DEVICE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240112924). INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113011). Semiconductor Structures And Methods Of Forming The Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113080). Semiconductor Device with Discrete Blocks simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113159). SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120272). SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120273). DEVICE WITH GATE-TO-DRAIN VIA AND RELATED METHODS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120277). CHIP STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240121965). VERTICALLY STACKED FeFETS WITH COMMON CHANNEL simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136203). PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136280). Conductive Traces in Semiconductor Devices and Methods of Forming Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136291). LOW-STRESS PASSIVATION LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136346). SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136418). SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240138135). MEMORY CELL STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178091). Integrated Circuit Package and Method simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178128). SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178132). VIA STRUCTURE HAVING LOW INTERFACE RESISTANCE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178133). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178214). LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178215). INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 30th, 2024
- Texas instruments incorporated (20240112953). METAL FILL STRUCTURES FOR ISOLATORS TO MEET METAL DENSITY AND HIGH VOLTAGE ELECTRIC FIELD REQUIREMENTS simplified abstract
- TEXAS INSTRUMENTS INCORPORATED patent applications on April 4th, 2024
U
- US Patent Application 17664466. METHOD OF FORMING AN INTERCONECT STRUCTURE OF A SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 17664671. ANGLED CONTACT WITH A NEGATIVE TAPERED PROFILE simplified abstract
- US Patent Application 17746381. INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING simplified abstract
- US Patent Application 17746955. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 17751976. DIELECTRIC SILICON NITRIDE BARRIER DEPOSITION PROCESS FOR IMPROVED METAL LEAKAGE AND ADHESION simplified abstract
- US Patent Application 17752704. SOURCE/DRAIN ISOLATION STRUCTURE, LAYOUT, AND METHOD simplified abstract
- US Patent Application 17804184. THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DUAL-DEPTH DRAIN-SELECT-LEVEL ISOLATION STRUCTURES AND METHODS FOR FORMING THE SAME simplified abstract
- US Patent Application 17819678. INTERCONNECT STRUCTURE PATTERN simplified abstract
- US Patent Application 17819679. Semiconductor Devices Including Backside Power Via and Methods of Forming the Same simplified abstract
- US Patent Application 17824481. METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE simplified abstract
- US Patent Application 17824924. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- US Patent Application 17825336. VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS simplified abstract
- US Patent Application 17825337. NON-VOLATILE MEMORY WITH INTER-DIE CONNECTION simplified abstract
- US Patent Application 17825345. INTERCONNECT STRUCTURE INCLUDING CHARGED DIELECTRIC LAYERS simplified abstract
- US Patent Application 17825698. SEMICONDUCTOR DEVICES WITH REDUCED EFFECT OF CAPACITIVE COUPLING simplified abstract
- US Patent Application 17827251. SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS simplified abstract
- US Patent Application 17827998. MEMORY DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- US Patent Application 17879140. Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Cells, Methods Used In Forming Integrated Circuitry, And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells simplified abstract
- US Patent Application 18143983. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- US Patent Application 18150189. SEMICONDUCTOR CELL STRUCTURE, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18153686. Trench Isolation Connectors for Stacked Structures simplified abstract
- US Patent Application 18181229. FERROELECTRIC-BASED MEMORY DEVICE AND METHOD OF FORMING THE SAME simplified abstract
- US Patent Application 18181293. REDISTRIBUTION LAYER METALLIC STRUCTURE AND METHOD simplified abstract
- US Patent Application 18227726. ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES simplified abstract
- US Patent Application 18227858. LANDING METAL ETCH PROCESS FOR IMPROVED OVERLAY CONTROL simplified abstract
- US Patent Application 18229679. SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- US Patent Application 18230338. SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 18231254. METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE WITH BONDING STRUCTURE simplified abstract
- US Patent Application 18231754. HIGH DENSITY METAL INSULATOR METAL CAPACITOR simplified abstract
- US Patent Application 18232200. Through-Circuit Vias In Interconnect Structures simplified abstract
- US Patent Application 18232312. DUAL-MODE WIRELESS CHARGING DEVICE simplified abstract
- US Patent Application 18232332. SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES simplified abstract
- US Patent Application 18232718. Contact Structure For Semiconductor Device simplified abstract
- US Patent Application 18232722. Liner-Free Conductive Structures With Anchor Points simplified abstract
- US Patent Application 18232833. METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH AIR SPACER simplified abstract
- US Patent Application 18300162. Vertically Integrated Device Stack Including System on Chip and Power Management Integrated Circuit simplified abstract
- US Patent Application 18345188. METAL GATE STRUCTURE CUTTING PROCESS simplified abstract
- US Patent Application 18358491. SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE simplified abstract
- US Patent Application 18359011. METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL simplified abstract
- US Patent Application 18359122. CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18359383. GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE simplified abstract
- US Patent Application 18359414. SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER AND METHOD FOR FORMING THE SAME simplified abstract
- US Patent Application 18359578. Stacked Semiconductor Device and Method simplified abstract
- US Patent Application 18360012. INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT simplified abstract
- US Patent Application 18360085. SEMICONDUCTOR DEVICES WITH BACKSIDE VIA AND METHODS THEREOF simplified abstract
- US Patent Application 18360901. Contact Via Formation simplified abstract
- US Patent Application 18361560. REDUCING RC DELAY IN SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 18361592. Semiconductor Device with Reduced Contact Resistance and Methods of Forming the Same simplified abstract
- US Patent Application 18362030. SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18362083. Method of Fabricating Redistribution Circuit Structure simplified abstract
- US Patent Application 18362248. ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES simplified abstract
- US Patent Application 18362731. THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF simplified abstract
- US Patent Application 18362739. SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE simplified abstract
- US Patent Application 18362824. CELL REGIONS AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract
- US Patent Application 18362839. SEMICONDUCTOR DEVICE INCLUDING STANDARD-CELL-ADAPTED POWER GRID ARRANGEMENT simplified abstract
- US Patent Application 18362862. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18363692. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 18363698. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- US Patent Application 18363769. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18364646. PROFILE OF DEEP TRENCH ISOLATION STRUCTURE FOR ISOLATION OF HIGH-VOLTAGE DEVICES simplified abstract
- US Patent Application 18365009. CAPACITOR BETWEEN TWO PASSIVATION LAYERS WITH DIFFERENT ETCHING RATES simplified abstract
- US Patent Application 18366156. A MULTI-LAYERED RESISTOR WITH A TIGHT TEMPERATURE COEFFICIENT OF RESISTANCE TOLERANCE simplified abstract
- US Patent Application 18366771. Functional Component Within Interconnect Structure of Semiconductor Device and Method of Forming Same simplified abstract
- US Patent Application 18366831. LOW-COST SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTURE simplified abstract
- US Patent Application 18446025. ADVANCED NODE INTERCONNECT ROUTING METHODOLOGY simplified abstract
- US Patent Application 18446326. GATE CONTACT STRUCTURE simplified abstract
- US Patent Application 18446648. Semiconductor Devices Including Decoupling Capacitors simplified abstract
- US Patent Application 18446873. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract
- US Patent Application 18446959. STORAGE SYSTEM INCLUDING A DECOUPLING DEVICE HAVING A PLURALITY OF UNIT CAPACITORS simplified abstract
- US Patent Application 18447084. IMPROVED CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE simplified abstract
- US Patent Application 18447134. ETCH METHOD FOR INTERCONNECT STRUCTURE simplified abstract
- US Patent Application 18447344. SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION simplified abstract
- US Patent Application 18447482. INDUCTIVE DEVICE simplified abstract
- US Patent Application 18447495. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- US Patent Application 18447572. METHOD OF MANUFACTURING INTEGRATED CIRCUIT simplified abstract
- US Patent Application 18447664. CONDUCTIVE RAIL STRUCTURE FOR SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 18447722. BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE simplified abstract
- US Patent Application 18448005. CELL STRUCTURE WITH INTERMEDIATE METAL LAYERS FOR POWER SUPPLIES simplified abstract
- US Patent Application 18448125. DIAGONAL VIA STRUCTURE simplified abstract