Taiwan semiconductor manufacturing co., ltd. (20240096753). SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THROUGH VIA AND METHOD FOR FORMING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THROUGH VIA AND METHOD FOR FORMING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THROUGH VIA AND METHOD FOR FORMING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THROUGH VIA AND METHOD FOR FORMING THE SAME
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Harry-Haklay Chuang of Zhubei City (TW)
Shiang-Hung Huang of New Taipei City (TW)
Hsin Fu Lin of Hsinchu County (TW)
SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THROUGH VIA AND METHOD FOR FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096753 titled 'SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THROUGH VIA AND METHOD FOR FORMING THE SAME
Simplified Explanation
The present disclosure describes a semiconductor device comprising a substrate with a device area and a peripheral area, a via extending through the substrate in the peripheral area, an insulating structure surrounding the via, and a doped region adjacent to the via in the peripheral area.
- Substrate with device and peripheral areas
- Via extending through the substrate in the peripheral area
- Insulating structure surrounding the via
- Doped region adjacent to the via
Potential Applications
This technology could be applied in the manufacturing of advanced semiconductor devices for various electronic applications such as integrated circuits, microprocessors, and memory chips.
Problems Solved
This innovation helps in improving the performance and reliability of semiconductor devices by providing efficient electrical connections and isolation between different components on the substrate.
Benefits
- Enhanced electrical connectivity - Improved device performance - Increased reliability
Potential Commercial Applications
"Enhancing Semiconductor Device Performance with Advanced Via Technology"
Possible Prior Art
One possible prior art could be the use of traditional via structures in semiconductor devices for electrical connections and isolation purposes.
Unanswered Questions
1. What specific materials are used in the insulating structure surrounding the via? 2. How does the doped region contribute to the overall functionality of the semiconductor device?
Original Abstract Submitted
the present disclosure provides a semiconductor device. the semiconductor device includes: a substrate having a device area and a peripheral area surrounding the device area; a via, disposed at the peripheral area and extending at least partially through the substrate; an insulating structure, disposed at the peripheral area, extending at least partially through the substrate and surrounding the via; and a doped region, disposed at the peripheral area, over or in the substrate and adjacent to the via.
