US Patent Application 18232332. SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES simplified abstract

SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Feng Wei Kuo of Hsinchu County (TW)

Chewn-Pu Jou of Hsinchu City (TW)

Huan-Neng Chen of Hsin-Chu City (TW)

Lan-Chou Cho of Hsinchu City (TW)

Robert Bogdan Staszewski of Dublin (IE)

SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18232332 titled 'SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES

Simplified Explanation

The patent application describes a circuit that includes a transformer, a grounded shield, and a circuit component.

• The transformer is located within a first layer and has an inductive footprint.
• The grounded shield is bounded by the inductive footprint within a second layer, which is separate from the first layer.
• The circuit component is bounded by the inductive footprint within a third layer, which is separate from the second layer.
• The circuit component is connected to the transformer through the second layer.
• The third layer is separated from the first layer by the second layer.

Original Abstract Submitted

In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.