Taiwan semiconductor manufacturing company, ltd. (20240120277). CHIP STRUCTURE simplified abstract
Contents
CHIP STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hong-Seng Shue of Zhubei City (TW)
Sheng-Han Tsai of Hsinchu (TW)
Kuo-Chin Chang of Chiayi City (TW)
Mirng-Ji Lii of Sinpu Township (TW)
Kuo-Ching Hsu of New Taipei City (TW)
CHIP STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120277 titled 'CHIP STRUCTURE
Simplified Explanation
The patent application describes a chip structure with a substrate, redistribution layer, bonding pad, shielding pad, insulating layer, and bump. The insulating layer has two parts with different thicknesses.
- The chip structure includes a substrate, redistribution layer, bonding pad, shielding pad, insulating layer, and bump.
- The insulating layer consists of two parts with different thicknesses, one surrounding the other.
Potential Applications
This technology could be applied in semiconductor manufacturing, electronic devices, and integrated circuits.
Problems Solved
This innovation helps in improving the reliability and performance of electronic components by providing better insulation and protection.
Benefits
The chip structure offers enhanced durability, reduced signal interference, and increased overall efficiency in electronic systems.
Potential Commercial Applications
The chip structure could be utilized in the production of smartphones, computers, automotive electronics, and other consumer electronics.
Possible Prior Art
Prior art may include patents related to chip packaging, insulating materials in electronic devices, and semiconductor manufacturing processes.
Unanswered Questions
How does this chip structure compare to existing insulation technologies in terms of performance and cost-effectiveness?
This article does not provide a direct comparison with existing insulation technologies in terms of performance and cost-effectiveness. Further research and testing would be needed to evaluate these aspects.
What specific electronic devices or industries could benefit the most from implementing this chip structure?
The article does not specify the specific electronic devices or industries that could benefit the most from implementing this chip structure. A market analysis and industry feedback would be necessary to determine the most suitable applications.
Original Abstract Submitted
a chip structure is provided. the chip structure includes a substrate, a redistribution layer over the substrate, a bonding pad over the redistribution layer, a shielding pad over the redistribution layer and surrounding the bonding pad, an insulating layer over the redistribution layer and the shielding pad, and a bump over the bonding pad and the insulating layer. the insulating layer includes a first part and a second part surrounded by the first part, the first part has first thickness, the second part has a second thickness, and the first thickness and the second thickness are different.
