Taiwan semiconductor manufacturing co., ltd. (20240096784). EXTENDED VIA CONNECT FOR PIXEL ARRAY simplified abstract

EXTENDED VIA CONNECT FOR PIXEL ARRAY

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Meng-Hsien Lin of Tainan City (TW)

Hsing-Chih Lin of Tainan City (TW)

Ming-Tsong Wang of Taipei City (TW)

Min-Feng Kao of Chiayi City (TW)

Kuan-Hua Lin of New Taipei City (TW)

Jen-Cheng Liu of Hsin-Chu City (TW)

Dun-Nian Yaung of Taipei City (TW)

Ko Chun Liu of Toufen Township (TW)

EXTENDED VIA CONNECT FOR PIXEL ARRAY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240096784 titled 'EXTENDED VIA CONNECT FOR PIXEL ARRAY

Simplified Explanation

The abstract of the patent application describes an integrated chip with an extended via that replaces a wire and an adjoining via, allowing for reduced spacing and smaller pixel size in capacitor arrays for pixel circuits.

• An integrated chip includes an extended via that spans the height of a wire and a via, with a smaller footprint than the wire.
• The extended via can replace a wire and an adjoining via in locations where wire sizing and spacing are limited, allowing for reduced spacing and smaller pixel size.
• The technology is particularly useful for capacitor arrays in pixel circuits.

Potential Applications

The technology can be applied in various fields such as semiconductor manufacturing, display technology, and electronic devices requiring compact and efficient circuitry.

Problems Solved

1. Limited spacing and size constraints in wire and via configurations. 2. Need for smaller pixel size in capacitor arrays for pixel circuits.

Benefits

1. Reduced spacing requirements. 2. Smaller pixel size. 3. Improved efficiency in circuit design.

Potential Commercial Applications

"Integrated Chip with Extended Via for Capacitor Arrays: Commercial Applications"

Possible Prior Art

There may be prior art related to integrated circuits and capacitor arrays in semiconductor manufacturing and display technologies.

Unanswered Questions

How does the extended via technology impact the overall performance of the integrated chip?

The abstract does not provide specific details on how the extended via technology affects the overall performance metrics such as speed, power consumption, or reliability.

Are there any limitations or drawbacks to using the extended via in integrated chips?

The abstract does not mention any potential limitations or drawbacks associated with the implementation of the extended via technology in integrated chips.

Original Abstract Submitted

some embodiments of the present disclosure relate to an integrated chip including an extended via that spans a combined height of a wire and a via and that has a smaller footprint than the wire. the extended via may replace a wire and an adjoining via at locations where the sizing and the spacing of the wire are reaching lower limits. because the extended via has a smaller footprint than the wire, replacing the wire and the adjoining via with the extended via relaxes spacing and allows the size of the pixel to be further reduced. the extended via finds application for capacitor arrays used for pixel circuits.