Taiwan semiconductor manufacturing co., ltd. (20240096800). SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION simplified abstract

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SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Fei Fan Duan of Hsinchu (TW)

Fong-yuan Chang of Hsinchu (TW)

Chi-Yu Lu of Hsinchu (TW)

Po-Hsiang Huang of Hsinchu (TW)

Chih-Liang Chen of Hsinchu (TW)

SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240096800 titled 'SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION

Simplified Explanation

The semiconductor device described in the abstract consists of active regions, conductive patterns, and metal lines interconnected in parallel on a substrate.

  • The semiconductor device includes first and second active regions on a substrate.
  • Multiple conductive patterns extend across the active regions on the substrate.
  • Several metal lines overlie and extend across the active regions.
  • Each conductive pattern is electrically connected in parallel with each metal line.

Potential Applications

The technology described in this semiconductor device can be applied in various electronic devices such as smartphones, tablets, computers, and other consumer electronics.

Problems Solved

This technology helps in improving the efficiency and performance of semiconductor devices by providing a parallel connection between active regions and metal lines, reducing resistance and enhancing electrical connectivity.

Benefits

The benefits of this technology include increased speed, reduced power consumption, improved reliability, and enhanced overall performance of electronic devices utilizing the semiconductor device.

Potential Commercial Applications

The semiconductor device can be utilized in the manufacturing of integrated circuits, microprocessors, memory chips, and other semiconductor components for commercial applications in the electronics industry.

Possible Prior Art

One possible prior art for this technology could be the use of similar parallel connections in semiconductor devices to enhance electrical connectivity and performance.

Unanswered Questions

How does this technology compare to existing semiconductor devices in terms of efficiency and performance?

This article does not provide a direct comparison between this technology and existing semiconductor devices in terms of efficiency and performance. Further research and analysis would be needed to determine the specific advantages of this technology over others.

What are the potential challenges or limitations of implementing this technology in practical applications?

The article does not address the potential challenges or limitations of implementing this technology in practical applications. Factors such as manufacturing costs, scalability, and compatibility with existing systems could pose challenges that need to be explored further.


Original Abstract Submitted

a semiconductor device includes first and second active regions extending in parallel in a substrate, a plurality of conductive patterns, each conductive pattern of the plurality of conductive patterns extending on the substrate across each of the first and second active regions, and a plurality of metal lines, each metal line of the plurality of metal lines overlying and extending across each of the first and second active regions. each conductive pattern of the plurality of conductive patterns is electrically connected in parallel with each metal line of the plurality of metal lines.