Taiwan semiconductor manufacturing company, ltd. (20240113159). SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract
Contents
- 1 SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Shu-Hui Su of Tucheng City (TW)
Hsin-Li Cheng of Hsin Chu (TW)
YingKit Felix Tsui of Cupertino CA (US)
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113159 titled 'SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
Simplified Explanation
The semiconductor die package includes multiple decoupling trench capacitor regions with varying depths to provide sufficient capacitance for circuit decoupling while reducing the risk of warping or breaking.
- Different depths of decoupling trench capacitor structures are used in the semiconductor die package.
- The depths are selected to meet circuit decoupling parameters while minimizing the risk of package damage.
Potential Applications
This technology could be applied in:
- Integrated circuits
- Power electronics
- Semiconductor devices
Problems Solved
This technology addresses issues such as:
- Ensuring proper circuit decoupling
- Preventing warping, breaking, and cracking of semiconductor die packages
Benefits
The benefits of this technology include:
- Improved circuit performance
- Enhanced reliability of semiconductor devices
- Reduced risk of package damage
Potential Commercial Applications
This technology could find commercial applications in:
- Consumer electronics
- Automotive electronics
- Telecommunications
Possible Prior Art
One possible prior art for this technology could be the use of decoupling capacitors in semiconductor devices to improve circuit performance and reliability.
Unanswered Questions
How does this technology compare to traditional decoupling capacitor structures in terms of performance and reliability?
This article does not provide a direct comparison between this technology and traditional decoupling capacitor structures. Further research or testing may be needed to determine the advantages and limitations of this innovation.
What are the potential cost implications of implementing this technology in semiconductor die packages?
The article does not discuss the cost implications of using this technology. It would be important to understand how the manufacturing process and materials used in these decoupling trench capacitor regions may impact the overall cost of semiconductor die packages.
Original Abstract Submitted
a semiconductor die included in a semiconductor die package may include a plurality of decoupling trench capacitor regions in a device region of the semiconductor die. at least two or more of the decoupling trench capacitor regions include decoupling trench capacitor structures having different depths. the depths of the decoupling trench capacitor structures in the decoupling trench capacitor regions may be selected to provide sufficient capacitance so as to satisfy circuit decoupling parameters for circuits of the semiconductor die package, while reducing the likelihood of warping, breaking, and/or cracking of the semiconductor die package.
