Sk hynix inc. (20240119996). MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE simplified abstract
Contents
- 1 MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE
Organization Name
Inventor(s)
Won Ha Choi of Gyeonggi-do (KR)
MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240119996 titled 'MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE
Simplified Explanation
The abstract describes a memory package with a package substrate, memory chip, buffer chip, interface data channel buses, and outer data channel buses.
- The memory package includes a package substrate.
- It has at least one memory chip and a buffer chip mounted on the package substrate.
- There are m*n number of interface data channel buses between the memory chip and the buffer chip.
- There are (m*n)/2 number of outer data channel buses connected to the buffer chip.
- The buffer chip receives data from the memory chip through the interface data channel buses and provides the data through the outer data channel buses.
Potential Applications
This technology could be applied in:
- High-performance computing systems
- Data centers
- Networking equipment
Problems Solved
This technology helps in:
- Improving data transfer speeds
- Enhancing memory performance
- Reducing latency in data processing
Benefits
The benefits of this technology include:
- Increased efficiency in data transfer
- Enhanced overall system performance
- Improved reliability and stability
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Server systems
- Supercomputers
- High-speed data processing equipment
Possible Prior Art
One possible prior art for this technology could be:
- Memory packages with buffer chips for improved data transfer speeds
Unanswered Questions
How does this technology impact power consumption in memory systems?
This article does not address the potential impact of this technology on power consumption in memory systems. Implementing additional components like buffer chips may have implications for power usage.
What are the cost implications of integrating buffer chips into memory packages?
The article does not discuss the cost implications of integrating buffer chips into memory packages. It would be important to understand how this technology affects the overall cost of memory systems.
Original Abstract Submitted
a single memory package includes a package substrate; at least one of a memory chip and a buffer chip mounted on the package substrate; m�n number of interface data channel buses between the memory chip and the buffer chip; and (m�n)/2number of outer data channel buses connected to the buffer chip. the buffer chip receives data from the memory chip through the interface data channel buses, and provides the data through the outer data channel buses. the m, n, and n are natural numbers.
