US Patent Application 18446025. ADVANCED NODE INTERCONNECT ROUTING METHODOLOGY simplified abstract

ADVANCED NODE INTERCONNECT ROUTING METHODOLOGY

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==

[[Category:Shih-Wei Peng of Hsinchu (TW)]]

[[Category:Jiann-Tyng Tzeng of Hsin Chu (TW)]]

ADVANCED NODE INTERCONNECT ROUTING METHODOLOGY - A simplified explanation of the abstract

This abstract first appeared for US patent application 18446025 titled 'ADVANCED NODE INTERCONNECT ROUTING METHODOLOGY

Simplified Explanation

The patent application describes a method for fabricating an integrated circuit.

• The method involves creating a first pattern metal layer with multiple metal tracks in a specific direction, each separated by a certain distance.
• A second pattern metal layer is then formed over the first layer, also consisting of metal tracks in the same direction but with a different separation distance.
• A third pattern metal layer is placed between the first and second layers.

Original Abstract Submitted

A method for fabricating an integrated circuit includes forming a first pattern metal layer comprising a plurality of metal tracks extending in a first direction. Each of the plurality of metal tracks is separated from its adjacent one of the plurality of metal tracks by a first pitch. The method further includes forming a second pattern metal layer formed over the first pattern metal layer. The second pattern metal layer comprises a second plurality of metal tracks extending in the first direction. Each of the second plurality of metal tracks is separated from its adjacent one of the second plurality of metal tracks by a second pitch. The method further includes forming a third pattern metal layer disposed between the first pattern metal layer and the second pattern metal layer.