US Patent Application 18232312. DUAL-MODE WIRELESS CHARGING DEVICE simplified abstract
Contents
DUAL-MODE WIRELESS CHARGING DEVICE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Shih-Wei Liang of Dajia Township (TW)
Hung-Yi Kuo of Taipei City (TW)
Hao-Yi Tsai of Hsinchu City (TW)
Ming-Hung Tseng of Toufen Township (TW)
Hsien-Ming Tu of Zhubei City (TW)
DUAL-MODE WIRELESS CHARGING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18232312 titled 'DUAL-MODE WIRELESS CHARGING DEVICE
Simplified Explanation
The patent application describes a method of making a semiconductor device.
- The method involves forming a first molding layer on a substrate.
- A first plurality of vias is formed in the first molding layer.
- A first conductive line is formed over the first molding layer, with one end of the line aligning with and being electrically coupled to a first via.
- A second molding layer is formed above the first molding layer.
- A second plurality of vias is formed in the second molding layer, with one via aligning with and being electrically coupled to the other end of the conductive line.
- The second plurality of vias, the conductive line, and the first plurality of vias are all electrically coupled to each other.
Original Abstract Submitted
A method of making a semiconductor device, includes: forming a first molding layer on a substrate; forming a first plurality of vias in the first molding layer; forming a first conductive line over the first molding layer, wherein the first conductive line is laterally disposed over the first molding layer and a first end of the conductive line aligns with and is electrically coupled to a first via of the first plurality of vias; forming a second molding layer above the first molding layer; and forming a second plurality of vias in the second molding layer, wherein a second via of the second plurality of vias aligns with and is electrically coupled to a second end of the conductive line, and wherein the second plurality of vias, the conductive line, and the first plurality of vias are electrically coupled to one another.
