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Category:H01L23/31
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Pages in category "H01L23/31"
The following 173 pages are in this category, out of 626 total.
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- Samsung electronics co., ltd. (20240136266). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136331). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136340). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136341). SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162104). SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD simplified abstract
- Samsung electronics co., ltd. (20240162127). SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS simplified abstract
- Samsung electronics co., ltd. (20240162133). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240162135). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240162188). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240162193). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162194). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162195). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240178122). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240178188). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240178191). SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240186231). SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240186289). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240186290). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240186294). SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 6th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 6th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 30th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096642). METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096719). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096722). Fan-Out Stacked Package and Methods of Making the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096731). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096760). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096781). PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096811). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096812). Semiconductor Device and Method of Manufacture simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096816). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096822). PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096827). SEMICONDUCTOR DEVICE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128143). PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128149). COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128196). SEMICONDUCTOR AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128218). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128232). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128261). Passive Device Dies With Measurement Structures simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128635). SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162109). Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162159). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162166). THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162171). METHOD FOR FABRICATING DEVICE DIE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186252). METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186308). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan Semiconductor manufacturing Co., Ltd. patent applications on April 18th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on May 16th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240105627). Semiconductor Devices and Methods of Manufacture simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105629). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105631). Three-Dimensional Semiconductor Device and Method simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105632). Method for Forming a Semiconductor Device Having TSV Formed Through a Silicon Interposer and a Second Silicon Substrate with Cavity Covering a Second Die simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105642). PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105701). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240107780). SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240112983). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113032). PACKAGED INTERCONNECT STRUCTURES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113080). Semiconductor Device with Discrete Blocks simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113089). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240114703). STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HYBRID INTERCONNECTION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120315). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136203). PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136246). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136251). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136280). Conductive Traces in Semiconductor Devices and Methods of Forming Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136299). SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178086). PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178090). PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178091). Integrated Circuit Package and Method simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178116). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178120). INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178133). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178152). METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 30th, 2024
- Texas instruments incorporated (20240113095). STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE simplified abstract
- Texas instruments incorporated (20240113155). WIRE BONDS FOR GALVANIC ISOLATION DEVICE simplified abstract
- Texas instruments incorporated (20240113413). MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE simplified abstract
- Texas instruments incorporated (20240178085). OPEN CAVITY INTEGRATED CIRCUIT simplified abstract
- Texas instruments incorporated (20240178104). LEADFRAME BASED POWER MODULE simplified abstract
- Texas instruments incorporated (20240178106). LEAD FRAME APPARATUS, SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE simplified abstract
- Texas instruments incorporated (20240178125). WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE simplified abstract
- Texas instruments incorporated (20240178163). Slot Bow-Tie Antenna On Package simplified abstract
- TEXAS INSTRUMENTS INCORPORATED patent applications on April 4th, 2024
- Texas Instruments Incorporated patent applications on February 1st, 2024
- Texas Instruments Incorporated patent applications on February 29th, 2024
- TEXAS INSTRUMENTS INCORPORATED patent applications on May 30th, 2024
U
- US Patent Application 17664538. SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING simplified abstract
- US Patent Application 17751234. Dummy through vias for Integrated Circuit Packages and Methods of Forming the Same simplified abstract
- US Patent Application 17752941. VIA STRUCTURE FOR EMBEDDED COMPONENT AND METHOD FOR MAKING SAME simplified abstract
- US Patent Application 17752976. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- US Patent Application 17825340. INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING INTEGRATED CIRCUIT DEVICES THEREIN simplified abstract
- US Patent Application 17825350. INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING RETICLE BOUNDARY / DICING STREETS OF MONOLITHIC STRUCTURES THEREIN simplified abstract
- US Patent Application 17826764. LASER ABLATION FOR DIE SEPARATION TO REDUCE LASER SPLASH AND ELECTRONIC DEVICE simplified abstract
- US Patent Application 17828691. Package and Method for Forming the Same simplified abstract
- US Patent Application 17828947. DIE ATTACH FILM DIE PAD ISOLATION FOR SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 17881128. SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF simplified abstract
- US Patent Application 17891634. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 17896840. Integrated Circuit Packages and Methods of Forming the Same simplified abstract
- US Patent Application 18067060. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- US Patent Application 18069318. SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract
- US Patent Application 18143983. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- US Patent Application 18177373. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18191092. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18230829. Method of Forming Semiconductor Packages Having Through Package Vias simplified abstract
- US Patent Application 18230999. SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME simplified abstract
- US Patent Application 18232312. DUAL-MODE WIRELESS CHARGING DEVICE simplified abstract
- US Patent Application 18232523. SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH simplified abstract
- US Patent Application 18303360. SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME simplified abstract
- US Patent Application 18303693. SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18316962. Embedded Packaging Concepts for Integration of ASICs and Optical Components simplified abstract
- US Patent Application 18346319. Integrated Circuit Package and Method Forming Same simplified abstract
- US Patent Application 18347013. HEAT DISSIPATION STRUCTURES simplified abstract
- US Patent Application 18358491. SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE simplified abstract
- US Patent Application 18358714. CHIP PACKAGE STRUCTURE simplified abstract
- US Patent Application 18358904. METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR simplified abstract
- US Patent Application 18358959. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18359909. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18360484. HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS simplified abstract
- US Patent Application 18360656. PACKAGE WITH FAN-OUT STRUCTURES simplified abstract
- US Patent Application 18361300. PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT simplified abstract
- US Patent Application 18361332. Package Structure and Method and Equipment for Forming the Same simplified abstract
- US Patent Application 18361464. SEMICONDUCTOR DEVICE WITH FIN ISOLATION simplified abstract
- US Patent Application 18361480. CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR simplified abstract
- US Patent Application 18361917. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18362083. Method of Fabricating Redistribution Circuit Structure simplified abstract
- US Patent Application 18362649. System Formed Through Package-In-Package Formation simplified abstract
- US Patent Application 18362968. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18363363. INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract
- US Patent Application 18363458. Semiconductor Package and Methods of Forming the Same simplified abstract
- US Patent Application 18363692. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 18363698. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- US Patent Application 18363742. MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18363766. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18363769. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18365063. PACKAGE COMPRISING AN INTEGRATED DEVICE CONFIGURED FOR SHAREABLE POWER RESOURCE simplified abstract
- US Patent Application 18365362. INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract
- US Patent Application 18446554. DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING simplified abstract
- US Patent Application 18446562. Polymer Layer in Semiconductor Device and Method of Manufacture simplified abstract
- US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract
- US Patent Application 18447416. SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME simplified abstract
- US Patent Application 18447428. Semiconductor Package and Method of Forming Thereof simplified abstract
- US Patent Application 18447443. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING simplified abstract
- US Patent Application 18447460. STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME simplified abstract
- US Patent Application 18449360. SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE DESIGN METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
- US Patent Application 18450291. INTEGRATED MAGNETIC ASSEMBLY WITH CONDUCTIVE FIELD PLATES simplified abstract