US Patent Application 18361300. PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT simplified abstract
Contents
PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Tai-Min Chang of Taipei City (TW)
De-Yuan Lu of Taipei City (TW)
Ming-Tan Lee of Kaohsiung City (TW)
PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18361300 titled 'PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT
Simplified Explanation
The patent application describes a package that includes a device die and an encapsulant that surrounds the die.
- The package also includes a first group of through-vias that go through the encapsulant.
- There is also a second group of through-vias that go through the encapsulant, but they are larger than the first group.
- The first group of through-vias are arranged in an array.
- The package also includes redistribution lines that are placed over and connected to the first group of through-vias.
Original Abstract Submitted
A package includes a device die, an encapsulant encapsulating the device die therein, a first plurality of through-vias penetrating through the encapsulant, a second plurality of through-vias penetrating through the encapsulant, and redistribution lines over and electrically coupling to the first plurality of through-vias. The first plurality of through-vias include an array. The second plurality of through-vias are outside of the first array, and the second plurality of through-vias are larger than the first plurality of through-vias.
