US Patent Application 17891634. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract
Contents
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Ping-Yin Hsieh of Hsinchu (TW)
Li-Hui Cheng of New Taipei City (TW)
Ying-Ching Shih of Hsinchu (TW)
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17891634 titled 'INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Simplified Explanation
The patent application describes a device that includes a package component with an integrated circuit die and conductive connectors on one side.
- The device also has a metal layer on the opposite side of the package component, with a thermal interface material and a lid on top.
- The device includes a retaining structure on the sidewalls of the package component and the thermal interface material.
- Additionally, there is a package substrate connected to the conductive connectors, with the lid adhered to it.
Original Abstract Submitted
An embodiment is a device including a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a first side of the package component. The device also includes a metal layer on a second side of the package component, the second side being opposite the first side. The device also includes a thermal interface material on the metal layer. The device also includes a lid on the thermal interface material. The device also includes a retaining structure on sidewalls of the package component and the thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.
