Taiwan semiconductor manufacturing company, ltd. (20240107780). SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION simplified abstract

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chih-Wei Wu of Zhuangwei Township (TW)

Ying-Ching Shih of Hsinchu City (TW)

Wen-Chih Chiou of Zhunan Township (TW)

An-Jhih Su of Taoyuan City (TW)

Chia-Nan Yuan of Hsinchu (TW)

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240107780 titled 'SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION

Simplified Explanation

The abstract describes a patent application for a system on chip (SoC) die package attached to a redistribution structure of a semiconductor device package, with the top surface of the SoC die package positioned above the top surface of an adjacent memory die package. This is achieved by using attachment structures to increase the height of the SoC die package, allowing heat to be dissipated through the top surface of the SoC die package.

• The SoC die package is attached to a redistribution structure of a semiconductor device package.
• The top surface of the SoC die package is positioned above the top surface of an adjacent memory die package.
• Attachment structures are used to increase the height of the SoC die package.
• Heat dissipation is enabled through the top surface of the SoC die package.

Potential Applications

This technology could be applied in various electronic devices where efficient heat dissipation is crucial, such as smartphones, tablets, and laptops.

Problems Solved

This technology solves the problem of heat buildup in compact electronic devices by enabling effective heat dissipation through the top surface of the SoC die package.

Benefits

The benefits of this technology include improved thermal management, increased performance and reliability of electronic devices, and potentially longer lifespan of the devices.

Potential Commercial Applications

The technology could be commercialized in the consumer electronics industry, particularly in the development of high-performance smartphones, tablets, and laptops.

Possible Prior Art

One possible prior art could be the use of heat sinks or thermal pads to dissipate heat in electronic devices. However, the specific approach of attaching the SoC die package to a redistribution structure to enhance heat dissipation may be a novel innovation.

How does this technology compare to traditional heat dissipation methods in electronic devices?

This article does not provide a direct comparison between this technology and traditional heat dissipation methods, such as heat sinks or thermal pads. Further research or testing would be needed to evaluate the effectiveness and efficiency of this new approach.

What are the potential challenges or limitations of implementing this technology in mass-produced electronic devices?

The article does not address any potential challenges or limitations that may arise when implementing this technology in mass-produced electronic devices. Factors such as cost, manufacturing complexity, and compatibility with existing device designs could be important considerations that need to be explored further.

Original Abstract Submitted

a system on chip (soc) die package is attached to a redistribution structure of a semiconductor device package such that a top surface of the soc die package is above a top surface of an adjacent memory die package. this may be achieved through the use of various attachment structures that increase the height of the soc die package. after encapsulating the memory die package and the soc die package in an encapsulation layer, the encapsulation layer is grinded down. the top surface of the soc die package being above the top surface of the adjacent memory die package results in the top surface of the soc die package being exposed through the encapsulation layer after the grinding operation. this enables heat to be dissipated through the top surface of the soc die package.