Taiwan semiconductor manufacturing co., ltd. (20240128149). COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE simplified abstract
Contents
- 1 COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Cheng-Chieh Hsieh of Tainan (TW)
Wei-Kong Sheng of Miaoli County (TW)
Ke-Han Shen of Chiayi City (TW)
Yu-Jen Lien of Tainan City (TW)
COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128149 titled 'COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE
Simplified Explanation
The patent application describes systems and techniques for fabricating a semiconductor die package with a cooling interface region that includes channel regions and pillar structures exposed to a fluid.
- The cooling interface region in the semiconductor die package is formed on the surface of an integrated circuit die.
- The cooling interface region includes a combination of channel regions and pillar structures.
- The cooling interface region is directly exposed to a fluid above and/or around the semiconductor die package.
Potential Applications
This technology could be applied in:
- High-performance computing systems
- Data centers
- Automotive electronics
Problems Solved
This technology addresses:
- Heat dissipation in integrated circuits
- Thermal management in electronic devices
Benefits
The benefits of this technology include:
- Improved cooling efficiency
- Enhanced performance and reliability of electronic devices
- Increased lifespan of semiconductor components
Potential Commercial Applications
Potential commercial applications of this technology include:
- Semiconductor manufacturing companies
- Electronics manufacturers
- Cooling system providers
Possible Prior Art
Prior art related to this technology may include:
- Liquid cooling systems for electronic devices
- Heat sink designs for integrated circuits
Unanswered Questions
How does this technology compare to traditional heat sink solutions in terms of cost-effectiveness?
The article does not provide a direct comparison between this technology and traditional heat sink solutions in terms of cost-effectiveness.
What impact does the direct exposure of the cooling interface region to a fluid have on the overall performance of the semiconductor die package?
The article does not delve into the specific impact of the direct exposure of the cooling interface region to a fluid on the overall performance of the semiconductor die package.
Original Abstract Submitted
some implementations described herein include systems and techniques for fabricating a semiconductor die package that includes a cooling interface region formed in surface of an integrated circuit die. the cooling interface region, which includes a combination of channel regions and pillar structures, may be directly exposed to a fluid above and/or around the semiconductor die package.
