Taiwan semiconductor manufacturing company, ltd. (20240105642). PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Hao-Jan Pei of Hsinchu (TW)

Ching-Hua Hsieh of Hsinchu (TW)

Hsiu-Jen Lin of Hsinchu County (TW)

Wei-Yu Chen of Taipei City (TW)

Chia-Shen Cheng of Hsinchu County (TW)

Chih-Chiang Tsao of Taoyuan City (TW)

Jen-Jui Yu of Taipei City (TW)

Cheng-Shiuan Wong of Hsinchu (TW)

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240105642 titled 'PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Simplified Explanation

The method described in the patent application involves the manufacturing of a package structure with specific steps including encapsulating a die and through vias, forming connectors, applying warpage control material, and adding a protection material with a lower coefficient of thermal expansion.

• Encapsulant layer formed to encapsulate die and through vias
• First connectors formed to connect to first surfaces of through vias
• Warpage control material applied over the die
• Protection material formed over encapsulant, connectors, and warpage control material with lower coefficient of thermal expansion

Potential Applications

This technology can be applied in the manufacturing of electronic packages, such as in semiconductor devices, to provide protection and control warpage.

Problems Solved

1. Warpage control: The warpage control material helps prevent deformation of the package structure, ensuring proper functionality. 2. Thermal expansion mismatch: The protection material with a lower coefficient of thermal expansion helps reduce stress on the package structure due to temperature changes.

Benefits

1. Improved reliability: By controlling warpage and thermal expansion, the package structure can maintain its integrity over time. 2. Enhanced performance: The protection material helps ensure stable electrical connections and overall functionality of the package.

Potential Commercial Applications

"Package Structure Manufacturing Method for Electronic Devices" can find applications in the semiconductor industry for producing reliable and high-performance electronic packages.

Possible Prior Art

One possible prior art could be the use of various materials for warpage control and protection in electronic packaging, but the specific combination of steps described in this patent application may be novel.

How does this method compare to traditional packaging techniques in terms of cost-effectiveness?

The article does not provide information on the cost implications of implementing this method compared to traditional packaging techniques.

What are the environmental impacts of using the materials mentioned in the patent application?

The article does not address the potential environmental effects of using the encapsulant, connectors, warpage control material, and protection material in the manufacturing process.

Original Abstract Submitted

a method of manufacturing a package structure at least includes the following steps. an encapsulant laterally is formed to encapsulate the die and the plurality of through vias. a plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. a warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. a protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. a coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.