Taiwan semiconductor manufacturing co., ltd. (20240128635). SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF simplified abstract

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Yung-Ping Chiang of Hsinchu County (TW)

Chao-Wen Shih of Hsinchu County (TW)

Shou-Zen Chang of New Taipei City (TW)

Albert Wan of Hsinchu City (TW)

Yu-Sheng Hsieh of New Taipei City (TW)

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128635 titled 'SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

Simplified Explanation

The patent application describes sensor packages with semiconductor chips and redistribution layer structures, including an antenna transmitter structure and an antenna receiver structure.

• The sensor package includes a semiconductor chip with a sensing surface.
• The redistribution layer structure forms an antenna transmitter structure beside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.

Potential Applications

This technology could be applied in various fields such as IoT devices, medical devices, automotive sensors, and industrial monitoring systems.

Problems Solved

1. Improved wireless communication capabilities in sensor packages. 2. Enhanced integration of antennas with semiconductor chips.

Benefits

1. Increased efficiency in data transmission. 2. Compact design for space-constrained applications. 3. Enhanced sensor performance and accuracy.

Potential Commercial Applications

"Wireless Sensor Packages for IoT Devices: Enhancing Communication Efficiency"

Possible Prior Art

There may be prior art related to sensor packages with integrated antennas, but specific examples are not provided in the patent application.

Unanswered Questions

How does this technology compare to existing sensor package designs in terms of cost-effectiveness?

The patent application does not provide information on the cost implications of implementing this technology compared to traditional sensor packages.

What are the potential limitations or challenges in manufacturing sensor packages with integrated antennas?

The patent application does not address any potential challenges or limitations that may arise during the manufacturing process of these sensor packages.

Original Abstract Submitted

sensor packages and manufacturing methods thereof are disclosed. one of the sensor packages includes a semiconductor chip and a redistribution layer structure. the semiconductor chip has a sensing surface. the redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.