US Patent Application 18359909. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Sung-Yueh Wu of Chiayi County (TW)
Chien-Ling Hwang of Hsinchu City (TW)
Jen-Chun Liao of Taipei City (TW)
Ching-Hua Hsieh of Hsinchu (TW)
Pei-Hsuan Lee of Tainan City (TW)
Chia-Hung Liu of Hsinchu City (TW)
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18359909 titled 'PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The patent application describes a package structure that includes a carrier substrate, a die, and an encapsulant.
- The carrier substrate has through carrier vias (TCV).
- The die is placed on top of the carrier substrate.
- The die consists of a semiconductor substrate and conductive posts on top of it.
- The conductive posts are facing away from the carrier substrate.
- The encapsulant surrounds the die from the sides.
- The encapsulant provides lateral protection to the die.
Original Abstract Submitted
A package structure includes a carrier substrate, a die, and an encapsulant. The carrier substrate includes through carrier vias (TCV). The die is disposed over the carrier substrate. The die includes a semiconductor substrate and conductive posts disposed over the semiconductor substrate. The conductive posts face away from the carrier substrate. The encapsulant laterally encapsulates the die.
