US Patent Application 18362649. System Formed Through Package-In-Package Formation simplified abstract

System Formed Through Package-In-Package Formation

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chen-Hua Yu of Hsinchu (TW)

Sung-Feng Yeh of Taipei City (TW)

Ming-Fa Chen of Taichung City (TW)

System Formed Through Package-In-Package Formation - A simplified explanation of the abstract

This abstract first appeared for US patent application 18362649 titled 'System Formed Through Package-In-Package Formation

Simplified Explanation

The patent application describes a package that includes multiple device dies bonded together through hybrid bonding.

• The package consists of a first device die and a second device die, with the second die being larger than the first die.
• The first device die is encapsulated within a first isolation region.
• The first device die, second device die, and first isolation region together form a first package.
• A third device die, larger than the first package, is bonded to the first package through hybrid bonding.
• The third device die is encapsulated within a second isolation region.
• The first package, third device die, and second isolation region together form a second package.

Original Abstract Submitted

A package includes a first device die, and a second device die bonded to the first device die through hybrid bonding. The second device die is larger than the first device die. A first isolation region encapsulates the first device die therein. The first device die, the second device die, and the first isolation region form parts of a first package. A third device die is bonded to the first package through hybrid bonding. The third device die is larger than the first package. A second isolation region encapsulates the first package therein. The first package, the third device die, and the second isolation region form parts of a second package.