US Patent Application 18347013. HEAT DISSIPATION STRUCTURES simplified abstract
Contents
HEAT DISSIPATION STRUCTURES
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Po-Hsiang Huang of Tainan City (TW)
Chin-chou Liu of Jhubei City (TW)
Chin-Her Chien of Chung-City (TW)
Fong-yuan Chang of Hsinchu (TW)
Hui Yu Lee of Hsin-Chu City (TW)
HEAT DISSIPATION STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18347013 titled 'HEAT DISSIPATION STRUCTURES
Simplified Explanation
- The patent application describes heat dissipating structures for three-dimensional system on integrated chip structures. - The structures can be formed in functional or non-functional areas. - The goal is to maintain an average operating temperature of memory dies or chips below 90° C. - The structure includes a stack with chip layers, each layer having one or more chips and an edge portion. - A thermal interface material is applied to the edge portion of each chip layer. - A thermal interface material layer is placed over the top chip layer of the stack. - A heat sink is then placed over the thermal interface material layer.
Original Abstract Submitted
The present disclosure describes heat dissipating structures that can be formed either in functional or non-functional areas of three-dimensional system on integrated chip structures. In some embodiments, the heat dissipating structures maintain an average operating temperature of memory dies or chips below about 90° C. For example, a structure includes a stack with chip layers, where each chip layer includes one or more chips and an edge portion. The structure further includes a thermal interface material disposed on the edge portion of each chip layer, a thermal interface material layer disposed over a top chip layer of the stack, and a heat sink over the thermal interface material layer.
