US Patent Application 18360484. HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS simplified abstract
HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Shu-Shen Yeh of Taoyuan City (TW)
Po-Yao Lin of Zhudong Township (TW)
HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18360484 titled 'HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS
Simplified Explanation
The patent application describes a semiconductor structure that includes a substrate, a package, and a heat-dissipation lid.
- The package is attached to the substrate and includes an interposer, dies, and a molding material.
- The interposer is bonded to the substrate through conductive bumps.
- The dies are attached to the interposer and surrounded by the molding material.
- The package also includes multiple thermal interface material (TIM) films.
- Each TIM film is directly over a respective die.
- The heat-dissipation lid is attached to the substrate and encloses the package and TIM films.
- The heat-dissipation lid contacts the TIM films, aiding in heat dissipation.
Original Abstract Submitted
A semiconductor structure includes: a substrate; a package attached to a first surface of the substrate, where the package includes: an interposer, where a first side of the interposer is bonded to the first surface of the substrate through first conductive bumps; dies attached to a second side of the interposer opposing the first side; and a molding material on the second side of the interposer around the dies; a plurality of thermal interface material (TIM) films on a first surface of the package distal from the substrate, where each of the TIM films is disposed directly over at least one respective die of the dies; and a heat-dissipation lid attached to the first surface of the substrate, where the package and the plurality of TIM films are disposed in an enclosed space between the heat-dissipation lid and the substrate, where the heat-dissipation lid contacts the plurality of TIM films.
