US Patent Application 18446554. DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING simplified abstract
DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING
Organization Name
Taiwan Semiconductor Manufacturing Company Limited
Inventor(s)
Chi-Yang Yu of Zhongli City (TW)
Kuan-Lin Ho of Hsinchu City (TW)
Chin-Liang Chen of Kaohsiung City (TW)
Yu-Min Liang of Zhongli City (TW)
Jiun Yi Wu of Zhongli City (TW)
DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18446554 titled 'DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING
Simplified Explanation
- The patent application describes a chip package structure that includes a fan-out package, epoxy molding compound (EMC) die frame, and a redistribution structure. - The fan-out package has chamfer regions that connect horizontal and vertical surfaces via angled surfaces. - The chip package structure may also include a package substrate and an underfill material portion. - The underfill material portion surrounds an array of solder material portions and contacts the angled surfaces. - The angled surfaces help distribute mechanical stress in the chamfer regions and prevent cracks in the underfill material portion.
Original Abstract Submitted
A chip package structure includes a fan-out package containing at least one semiconductor die, an epoxy molding compound (EMC) die frame laterally surrounding the at least one semiconductor die, and a redistribution structure. The fan-out package has chamfer regions at which horizontal surfaces and vertical surfaces of the fan-out package are connected via angled surfaces that are not horizontal and not vertical. The chip package structure may include a package substrate that is attached to the fan-out package via an array of solder material portions, and an underfill material portion that laterally surrounds the array of solder material portions and contacts an entirety of the angled surfaces. The angled surfaces eliminate a sharp corner at which mechanical stress may be concentrated, and distribute local mechanical stress in the chamfer regions over a wide region to prevent cracks in the underfill material portion.
