Taiwan semiconductor manufacturing co., ltd. (20240096731). SEMICONDUCTOR PACKAGE simplified abstract

SEMICONDUCTOR PACKAGE

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Chin-Hua Wang of New Taipei City (TW)

Po-Yao Lin of Zhudong Township (TW)

Feng-Cheng Hsu of New Taipei City (TW)

Shin-Puu Jeng of Po-Shan Village, Hsinchu (TW)

Wen-Yi Lin of New Taipei City (TW)

Shu-Shen Yeh of Taoyuan City (TW)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240096731 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The semiconductor package described in the abstract includes a first chip, a molding compound, thermal interface materials, and a heat spreader. The first and second thermal interface materials have identical widths.

• The semiconductor package includes a first chip disposed over a first package substrate.
• A molding compound surrounds the first chip.
• A first thermal interface material is disposed over the first chip and the molding compound.
• A heat spreader is placed over the thermal interface material.
• A second thermal interface material is disposed over the heat spreader.

Potential Applications

This technology could be applied in various electronic devices that require efficient heat dissipation, such as computers, smartphones, and servers.

Problems Solved

This innovation helps in improving thermal management in semiconductor packages, ensuring better performance and reliability of electronic devices.

Benefits

The use of identical width thermal interface materials helps in achieving uniform heat dissipation across the semiconductor package, leading to improved overall performance and longevity of the electronic device.

Potential Commercial Applications

"Enhanced Thermal Management in Semiconductor Packages: Improving Performance and Reliability"

Possible Prior Art

There may be prior art related to thermal interface materials and heat spreaders used in semiconductor packages, but specific examples are not provided in this abstract.

How does this technology compare to existing thermal management solutions in terms of efficiency and cost-effectiveness?

This article does not provide a direct comparison with existing thermal management solutions, leaving the reader to wonder about the advantages of this specific technology over others in the market.

What impact could this innovation have on the overall design and size of electronic devices?

The abstract does not address how the use of identical width thermal interface materials and heat spreaders may affect the design and size of electronic devices, leaving this aspect open for further exploration.

Original Abstract Submitted

a semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. the first thermal interface material and the second thermal interface material have an identical width.