Taiwan Semiconductor Manufacturing Co., Ltd. patent applications published on December 14th, 2023
Summary of the patent applications from Taiwan Semiconductor Manufacturing Co., Ltd. on December 14th, 2023
Taiwan Semiconductor Manufacturing Co., Ltd. has recently filed several patents related to memory devices, semiconductor devices, and image sensor devices. These patents aim to improve the performance, reliability, and efficiency of these technologies.
One patent describes a memory device with a laminated structure of alternating layers of different phase change materials. This device offers improved performance, increased data storage capacity, and improved energy efficiency.
Another patent focuses on a magnetic tunnel junction (MTJ) structure for data storage. The MTJ structure includes metal particles distributed in a discrete and non-continuous manner, allowing for higher data storage density and enhanced stability.
A patent application describes a method for forming a circuit region on a substrate, simplifying the formation process and providing efficient electrical coupling to external circuitry.
Another patent application introduces a semiconductor device that uses a ferroelectric film to alter the effective resistance. This technology has applications in memory devices and sensor devices, offering improved memory performance and enhanced sensor sensitivity.
The organization has also filed a patent for a semiconductor device with a ferroelectric layer doped with cerium and another dopant. This device provides improved functionality, stability, and compatibility with existing electronic systems.
Additionally, a patent application describes a semiconductor device with a ferroelectric tunnel junction (FTJ) that offers non-volatile memory capabilities, low-power operation, and high-speed performance.
Lastly, a patent application presents a method for forming a ferroelectric memory device with a polarization switching structure arranged directly on the gate electrode. This method allows for a smaller pad size, more flexible area ratio tuning, and better control of the ferroelectric structure quality.
Notable applications of these technologies include memory devices in electronic devices, non-volatile memory for data storage, logic circuits, magnetic sensors, integrated circuits, microprocessors, power electronics, sensors, digital cameras, smartphones, surveillance systems, and medical imaging devices.
Contents
- 1 Patent applications for Taiwan Semiconductor Manufacturing Co., Ltd. on December 14th, 2023
- 1.1 CHARGED PARTICLE FILTER AND REMOVAL SYSTEM (17839343)
- 1.2 Polishing Pad for Chemical Mechanical Polishing and Method (17822867)
- 1.3 MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER (17835175)
- 1.4 SEMICONDUCTOR PROCESS CHAMBER WITH IMPROVED REFLECTOR (17837910)
- 1.5 NOVEL JITTER NOISE DETECTOR (18232341)
- 1.6 PHOTONIC DEVICE, SYSTEM AND METHOD OF MAKING SAME (17836879)
- 1.7 EDGE COUPLERS AND METHODS OF MAKING THE SAME (18232319)
- 1.8 OPTICAL COUPLING APPARATUS AND METHODS OF MAKING SAME (18232342)
- 1.9 MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS (18231760)
- 1.10 LITHOGRAPHY SYSTEM AND METHODS (18446400)
- 1.11 METHOD OF USING WAFER STAGE (18448110)
- 1.12 LITHOGRAPHY SYSTEM AND METHOD THEREOF (18361728)
- 1.13 MITIGATING LONG-TERM ENERGY DECAY OF LASER DEVICES (18210548)
- 1.14 INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME (17825383)
- 1.15 SYSTEMS AND METHODS FOR CONTEXT AWARE CIRCUIT DESIGN (18232742)
- 1.16 METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT FOR INTEGRATED CIRCUIT DESIGN (18446739)
- 1.17 REDUCED AREA STANDARD CELL ABUTMENT CONFIGURATIONS (18447187)
- 1.18 INTEGRATED CIRCUIT HAVING HYBRID SHEET STRUCTURE (18448136)
- 1.19 PIN ACCESS HYBRID CELL HEIGHT DESIGN AND SYSTEM (18362842)
- 1.20 OPTICAL SENSOR AND METHODS OF MAKING THE SAME (18232756)
- 1.21 MEMORY DEVICE (18451946)
- 1.22 MEMORY CIRCUIT AND METHOD OF OPERATING SAME (18362952)
- 1.23 HEAT CONTROLLED SWITCH (17834944)
- 1.24 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17838246)
- 1.25 SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME (17838253)
- 1.26 METHOD FOR FABRICATING MASK (17836820)
- 1.27 SELECTIVE ETCHING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME (17836452)
- 1.28 METHOD FOR FILLING TRENCH IN SEMICONDUCTOR DEVICE (17836463)
- 1.29 CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE (18447539)
- 1.30 DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES (18447581)
- 1.31 SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING (18366864)
- 1.32 MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING (18230664)
- 1.33 Forming Structures In Empty Regions On Wafers With Dual Seal Ring Structures (17839292)
- 1.34 Molding Structures for Integrated Circuit Packages and Methods of Forming the Same (17840362)
- 1.35 SEMICONDUCTOR DEVICE (17746990)
- 1.36 Semiconductor Package and Method (17806532)
- 1.37 HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME (17837312)
- 1.38 SEMICONDUCTOR DEVICE AND METHOD OF FORMING REDISTRIBUTION STRUCTURES OF CONDUCTIVE ELEMENTS (17835776)
- 1.39 SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE (17836781)
- 1.40 SIGNAL CONDUCTING LINE ARRANGEMENTS IN INTEGRATED CIRCUITS (18447682)
- 1.41 GRAPHENE-METAL HYBRID INTERCONNECT (17835924)
- 1.42 GRAPHENE-CLAD METAL INTERCONNECT (17837664)
- 1.43 SEMICONDUCTOR DEVICE INCLUDING DIELECTRICS MADE OF POROUS ORGANIC FRAMEWORKS, AND METHOD OF FABRICATING THE SAME (17839447)
- 1.44 Semiconductor Package and Method (17663683)
- 1.45 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE (17746822)
- 1.46 PROTECTION LAYER FOR SEMICONDUCTOR DEVICE (18186754)
- 1.47 Wafer Level Multi-Die Structure Formation (17839946)
- 1.48 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING (17806311)
- 1.49 HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING (18447528)
- 1.50 METHOD OF FORMING PACKAGE STRUCTURE (17838292)
- 1.51 Methods of Forming Packages and Resulting Structures (18151758)
- 1.52 INTEGRATED STANDARD CELL STRUCTURE (17837925)
- 1.53 SEMICONDUCTOR DEVICE AND METHOD OF OPERATING SAME (18447857)
- 1.54 INTEGRATED CIRCUIT LAYOUT METHOD (18448155)
- 1.55 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME (18097255)
- 1.56 INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME (18448101)
- 1.57 IMAGE SENSOR (17837534)
- 1.58 APPARATUS AND METHODS FOR SENSING LONG WAVELENGTH LIGHT (18232323)
- 1.59 PIXEL SENSOR INCLUDING REFRACTION STRUCTURES (18366175)
- 1.60 METHOD OF MANUFACTURING SEMICONDUCTOR IMAGE SENSOR (18448093)
- 1.61 INTEGRATION OF SOLAR CELL AND IMAGE SENSOR (17892846)
- 1.62 REDUCED CROSS-TALK IN COLOR AND INFRARED IMAGE SENSOR (18366776)
- 1.63 IMAGE SENSOR WITH HIGH QUANTUM EFFICIENCY (18447890)
- 1.64 DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF (17838994)
- 1.65 VERTICALLY ARRANGED SEMICONDUCTOR PIXEL SENSOR (18447529)
- 1.66 INTEGRATED CIRCUIT WITH FEOL RESISTOR (18448111)
- 1.67 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME (17827779)
- 1.68 Epitaxial Structures In Semiconductor Devices (18128061)
- 1.69 Transistor Gate Structures and Methods of Forming the Same (18150474)
- 1.70 SEMICONDUCTOR DEVICE WITH DIELECTRIC LINERS ON GATE REFILL METAL (17837613)
- 1.71 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME (17837833)
- 1.72 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME (17839127)
- 1.73 MULTI-SILICIDE STRUCTURE FOR A SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME (18447580)
- 1.74 Semiconductor Structures With Reduced Parasitic Capacitance And Methods For Forming The Same (18177409)
- 1.75 Parasitic Capacitance Reduction (18357307)
- 1.76 CASCADED BIPOLAR JUNCTION TRANSISTOR AND METHODS OF FORMING THE SAME (17838894)
- 1.77 CHANNEL STRUCTURES INCLUDING DOPED 2D MATERIALS FOR SEMICONDUCTOR DEVICES (18452581)
- 1.78 FIELD EFFECT TRANSISTOR WITH GATE ISOLATION STRUCTURE AND METHOD (18163857)
- 1.79 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME (18360471)
- 1.80 FIN FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF (17838303)
- 1.81 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17836399)
- 1.82 FORMING INTEGRATED ELECTRONIC DEVICES FOR CONVERTING AND DOWNSCALING ALTERNATING CURRENT (17806670)
- 1.83 SYSTEMS AND METHODS FOR SUPPRESSING AND MITIGATING HARMONIC DISTORTION IN A CIRCUIT (18232343)
- 1.84 SYSTEM, METHOD, CIRCUIT, AND DEVICE FOR MILLIMETER-WAVE MULTI-STAGE AMPLIFIER WITH INDUCTIVE COUPLING (17836359)
- 1.85 Semiconductor Devices And Circuits With Increased Breakdown Voltage (17835688)
- 1.86 IMAGE SENSOR FOR SENSING LED LIGHT WITH REDUCED FLICKERING (18364873)
- 1.87 SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (17835769)
- 1.88 SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (18446043)
- 1.89 EMBEDDED FERROELECTRIC FINFET MEMORY DEVICE (18364616)
- 1.90 FERROELECTRIC TUNNEL JUNCTIONS WITH CONDUCTIVE ELECTRODES HAVING ASYMMETRIC NITROGEN OR OXYGEN PROFILES (17834939)
- 1.91 SEMICONDUCTOR DEVICES (17835988)
- 1.92 FERROELECTRIC TUNNEL JUNCTION MEMORY DEVICES WITH ENHANCED READ WINDOW (17840003)
- 1.93 METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE (18447614)
- 1.94 MAGNETO-RESISTIVE RANDOM-ACCESS MEMORY (MRAM) DEVICES AND METHODS OF FORMING THE SAME (17838235)
- 1.95 PHASE-CHANGE RANDOM ACCESS MEMORY DEVICE AND METHOD OF FORMING THE SAME (17838166)
Patent applications for Taiwan Semiconductor Manufacturing Co., Ltd. on December 14th, 2023
CHARGED PARTICLE FILTER AND REMOVAL SYSTEM (17839343)
Main Inventor
En Tian LIN
Polishing Pad for Chemical Mechanical Polishing and Method (17822867)
Main Inventor
Te-Chien Hou
MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER (17835175)
Main Inventor
Fan Hu
SEMICONDUCTOR PROCESS CHAMBER WITH IMPROVED REFLECTOR (17837910)
Main Inventor
Sou-Chuan CHIANG
NOVEL JITTER NOISE DETECTOR (18232341)
Main Inventor
Tien-Chien HUANG
PHOTONIC DEVICE, SYSTEM AND METHOD OF MAKING SAME (17836879)
Main Inventor
Weiwei SONG
EDGE COUPLERS AND METHODS OF MAKING THE SAME (18232319)
Main Inventor
Min-Hsiang HSU
OPTICAL COUPLING APPARATUS AND METHODS OF MAKING SAME (18232342)
Main Inventor
Chan-Hong CHERN
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS (18231760)
Main Inventor
Hsin-Yu CHEN
LITHOGRAPHY SYSTEM AND METHODS (18446400)
Main Inventor
Cheng Hung TSAI
METHOD OF USING WAFER STAGE (18448110)
Main Inventor
Yung-Yao LEE
LITHOGRAPHY SYSTEM AND METHOD THEREOF (18361728)
Main Inventor
Shao-Hua WANG
MITIGATING LONG-TERM ENERGY DECAY OF LASER DEVICES (18210548)
Main Inventor
Chih-Ping YEN
INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME (17825383)
Main Inventor
Ching-Yu HUANG
SYSTEMS AND METHODS FOR CONTEXT AWARE CIRCUIT DESIGN (18232742)
Main Inventor
Li-Chung HSU
METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT FOR INTEGRATED CIRCUIT DESIGN (18446739)
Main Inventor
Chin-Shen LIN
REDUCED AREA STANDARD CELL ABUTMENT CONFIGURATIONS (18447187)
Main Inventor
Chi-Yu LU
INTEGRATED CIRCUIT HAVING HYBRID SHEET STRUCTURE (18448136)
Main Inventor
Shang-Wei FANG
PIN ACCESS HYBRID CELL HEIGHT DESIGN AND SYSTEM (18362842)
Main Inventor
Kam-Tou SIO
OPTICAL SENSOR AND METHODS OF MAKING THE SAME (18232756)
Main Inventor
You-Cheng JHANG
MEMORY DEVICE (18451946)
Main Inventor
CHIEN-AN LAI
MEMORY CIRCUIT AND METHOD OF OPERATING SAME (18362952)
Main Inventor
Meng-Sheng CHANG
HEAT CONTROLLED SWITCH (17834944)
Main Inventor
Yu-Wei Ting
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (17838246)
Main Inventor
Chin-Ta CHEN
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME (17838253)
Main Inventor
Yan-Ming Tsai
METHOD FOR FABRICATING MASK (17836820)
Main Inventor
Ping-Hsun LIN
SELECTIVE ETCHING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME (17836452)
Main Inventor
Kuan-Da HUANG
METHOD FOR FILLING TRENCH IN SEMICONDUCTOR DEVICE (17836463)
Main Inventor
Kenichi SANO
CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE (18447539)
Main Inventor
Po-Hsien CHENG
DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES (18447581)
Main Inventor
Tsung-Hsing Lu
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING (18366864)
Main Inventor
Hung-Yao Chen
MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING (18230664)
Main Inventor
Feng-Chien Hsieh
Forming Structures In Empty Regions On Wafers With Dual Seal Ring Structures (17839292)
Main Inventor
Shan-Yu Huang
Molding Structures for Integrated Circuit Packages and Methods of Forming the Same (17840362)
Main Inventor
Shu-Shen Yeh
SEMICONDUCTOR DEVICE (17746990)
Main Inventor
Yu-Hung Lin
Semiconductor Package and Method (17806532)
Main Inventor
Chen Chiang Yu
HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME (17837312)
Main Inventor
Szu-Wei Lu
SEMICONDUCTOR DEVICE AND METHOD OF FORMING REDISTRIBUTION STRUCTURES OF CONDUCTIVE ELEMENTS (17835776)
Main Inventor
Ho Che Yu
SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE (17836781)
Main Inventor
Shuen-Shin LIANG
SIGNAL CONDUCTING LINE ARRANGEMENTS IN INTEGRATED CIRCUITS (18447682)
Main Inventor
Wei-Ling CHANG
GRAPHENE-METAL HYBRID INTERCONNECT (17835924)
Main Inventor
Jian-Hong LIN
GRAPHENE-CLAD METAL INTERCONNECT (17837664)
Main Inventor
Jian-Hong LIN
SEMICONDUCTOR DEVICE INCLUDING DIELECTRICS MADE OF POROUS ORGANIC FRAMEWORKS, AND METHOD OF FABRICATING THE SAME (17839447)
Main Inventor
Szu-Hua Chen
Semiconductor Package and Method (17663683)
Main Inventor
Shu-Shen Yeh
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE (17746822)
Main Inventor
Hsien-Wei Chen
PROTECTION LAYER FOR SEMICONDUCTOR DEVICE (18186754)
Main Inventor
I-Han Huang
Wafer Level Multi-Die Structure Formation (17839946)
Main Inventor
Shan-Yu Huang
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING (17806311)
Main Inventor
Chien LI
HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING (18447528)
Main Inventor
Kuang-Wei CHENG
METHOD OF FORMING PACKAGE STRUCTURE (17838292)
Main Inventor
Wen-Chih Chiou
Methods of Forming Packages and Resulting Structures (18151758)
Main Inventor
Chien-Fu Tseng
INTEGRATED STANDARD CELL STRUCTURE (17837925)
Main Inventor
Shih-Hsien Huang
SEMICONDUCTOR DEVICE AND METHOD OF OPERATING SAME (18447857)
Main Inventor
Liu HAN
INTEGRATED CIRCUIT LAYOUT METHOD (18448155)
Main Inventor
Po-Zeng KANG
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME (18097255)
Main Inventor
Ya-Yi TSAI
INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME (18448101)
Main Inventor
Te-Hsin CHIU
IMAGE SENSOR (17837534)
Main Inventor
Chun-Hao CHUANG
APPARATUS AND METHODS FOR SENSING LONG WAVELENGTH LIGHT (18232323)
Main Inventor
Yun-Wei CHENG
PIXEL SENSOR INCLUDING REFRACTION STRUCTURES (18366175)
Main Inventor
Wei-Lin CHEN
METHOD OF MANUFACTURING SEMICONDUCTOR IMAGE SENSOR (18448093)
Main Inventor
Li-Wen HUANG
INTEGRATION OF SOLAR CELL AND IMAGE SENSOR (17892846)
Main Inventor
Feng-Chien Hsieh
REDUCED CROSS-TALK IN COLOR AND INFRARED IMAGE SENSOR (18366776)
Main Inventor
Keng-Yu Chou
IMAGE SENSOR WITH HIGH QUANTUM EFFICIENCY (18447890)
Main Inventor
Feng-Chien HSIEH
DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF (17838994)
Main Inventor
Bi-Shen LEE
VERTICALLY ARRANGED SEMICONDUCTOR PIXEL SENSOR (18447529)
Main Inventor
Feng-Chien HSIEH
INTEGRATED CIRCUIT WITH FEOL RESISTOR (18448111)
Main Inventor
Tien-Chien HUANG
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME (17827779)
Main Inventor
Yi-Ruei Jhan
Epitaxial Structures In Semiconductor Devices (18128061)
Main Inventor
Cheng-Wei CHANG
Transistor Gate Structures and Methods of Forming the Same (18150474)
Main Inventor
Chung-Wei Hsu
SEMICONDUCTOR DEVICE WITH DIELECTRIC LINERS ON GATE REFILL METAL (17837613)
Main Inventor
Yuan-Hsiang WU
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME (17837833)
Main Inventor
Tzu-Ging LIN
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME (17839127)
Main Inventor
Li-Zhen YU
MULTI-SILICIDE STRUCTURE FOR A SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME (18447580)
Main Inventor
Chung-Liang CHENG
Semiconductor Structures With Reduced Parasitic Capacitance And Methods For Forming The Same (18177409)
Main Inventor
Szu-Hua Chen
Parasitic Capacitance Reduction (18357307)
Main Inventor
Jia-Heng Wang
CASCADED BIPOLAR JUNCTION TRANSISTOR AND METHODS OF FORMING THE SAME (17838894)
Main Inventor
Hong-Shyang WU
CHANNEL STRUCTURES INCLUDING DOPED 2D MATERIALS FOR SEMICONDUCTOR DEVICES (18452581)
Main Inventor
Ching-Hua Lee
FIELD EFFECT TRANSISTOR WITH GATE ISOLATION STRUCTURE AND METHOD (18163857)
Main Inventor
Kuo-Cheng CHIANG
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME (18360471)
Main Inventor
Sai-Hooi YEONG
FIN FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF (17838303)
Main Inventor
Ya-Yi Tsai
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17836399)
Main Inventor
Li-Zhen YU
FORMING INTEGRATED ELECTRONIC DEVICES FOR CONVERTING AND DOWNSCALING ALTERNATING CURRENT (17806670)
Main Inventor
Yen-Ku LIN
SYSTEMS AND METHODS FOR SUPPRESSING AND MITIGATING HARMONIC DISTORTION IN A CIRCUIT (18232343)
Main Inventor
Feng-Wei KUO
SYSTEM, METHOD, CIRCUIT, AND DEVICE FOR MILLIMETER-WAVE MULTI-STAGE AMPLIFIER WITH INDUCTIVE COUPLING (17836359)
Main Inventor
Wei Ling Chang
Semiconductor Devices And Circuits With Increased Breakdown Voltage (17835688)
Main Inventor
Yi-An Lai
IMAGE SENSOR FOR SENSING LED LIGHT WITH REDUCED FLICKERING (18364873)
Main Inventor
Yun-Wei Cheng
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (17835769)
Main Inventor
Meng-Han Lin
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (18446043)
Main Inventor
Peng-Chun Liou
EMBEDDED FERROELECTRIC FINFET MEMORY DEVICE (18364616)
Main Inventor
Bo-Feng Young
FERROELECTRIC TUNNEL JUNCTIONS WITH CONDUCTIVE ELECTRODES HAVING ASYMMETRIC NITROGEN OR OXYGEN PROFILES (17834939)
Main Inventor
Yi-Hsuan Chen
SEMICONDUCTOR DEVICES (17835988)
Main Inventor
Ying-Chih Chen
FERROELECTRIC TUNNEL JUNCTION MEMORY DEVICES WITH ENHANCED READ WINDOW (17840003)
Main Inventor
Wei Ting HSIEH
METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE (18447614)
Main Inventor
Jerry Chang Jui KAO
MAGNETO-RESISTIVE RANDOM-ACCESS MEMORY (MRAM) DEVICES AND METHODS OF FORMING THE SAME (17838235)
Main Inventor
Hsuan-Yi PENG
PHASE-CHANGE RANDOM ACCESS MEMORY DEVICE AND METHOD OF FORMING THE SAME (17838166)
Main Inventor
Chin I WANG
