17835776. SEMICONDUCTOR DEVICE AND METHOD OF FORMING REDISTRIBUTION STRUCTURES OF CONDUCTIVE ELEMENTS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

SEMICONDUCTOR DEVICE AND METHOD OF FORMING REDISTRIBUTION STRUCTURES OF CONDUCTIVE ELEMENTS

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Ho Che Yu of Zhubei City (TW)

Fong-yuan Chang of Hsinchu County (TW)

Ting-Chieh Hsu of Hsinchu County (TW)

Chun-Hua Chang of Zhubei City (TW)

SEMICONDUCTOR DEVICE AND METHOD OF FORMING REDISTRIBUTION STRUCTURES OF CONDUCTIVE ELEMENTS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17835776 titled 'SEMICONDUCTOR DEVICE AND METHOD OF FORMING REDISTRIBUTION STRUCTURES OF CONDUCTIVE ELEMENTS

Simplified Explanation

The abstract describes a semiconductor device and its manufacturing method. Here is a simplified explanation of the abstract:

• The invention involves a semiconductor device that consists of a first semiconductor die placed on a first redistribution structure.
• On the opposite side of the first redistribution structure, a second redistribution structure is placed.
• Additionally, a third redistribution structure is placed on the opposite surface of the semiconductor die as the first redistribution structure.
• Through via structures are used to connect at least one of the redistribution structures to the active surface of the semiconductor die.

Potential applications of this technology:

• This semiconductor device and manufacturing method can be used in various electronic devices such as smartphones, computers, and other consumer electronics.
• It can also be applied in industrial applications such as automation systems, robotics, and automotive electronics.

Problems solved by this technology:

• The invention solves the problem of connecting redistribution structures to the active surface of a semiconductor die.
• It provides a reliable and efficient method for connecting different components of a semiconductor device.

Benefits of this technology:

• The use of through via structures allows for efficient and reliable connections between redistribution structures and the active surface of the semiconductor die.
• The manufacturing method described in the patent application provides a cost-effective solution for producing semiconductor devices with improved connectivity.
• The invention enables the development of smaller and more compact electronic devices without compromising performance.

Original Abstract Submitted

A semiconductor device and method of manufacture in which a first semiconductor die is disposed along a first redistribution structure, and a second redistribution structure is disposed along an opposite side of the first redistribution structure. A third redistribution structure may be disposed along an opposite surface of the semiconductor die as the first redistribution structure. Through via structures pass through at least the first redistribution structure to connect at least one of the redistribution structures to an active surface of the semiconductor die.