17806532. Semiconductor Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
Semiconductor Package and Method
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chen Chiang Yu of Taoyuan City (TW)
Tsung-Fu Tsai of Changhua City (TW)
Semiconductor Package and Method - A simplified explanation of the abstract
This abstract first appeared for US patent application 17806532 titled 'Semiconductor Package and Method
Simplified Explanation
The abstract describes a semiconductor package with a cooling system and a method of forming it. The package includes an interposer, package components bonded to the interposer, an encapsulant on the interposer, and a cooling system over the package components. The cooling system consists of metal layers on top surfaces of the package components, first metal pins on the metal layers, second metal pins bonded to the first metal pins with solder, and a lid with openings over the second metal pins.
- The semiconductor package includes a cooling system to prevent overheating of the components.
- The cooling system consists of metal layers, metal pins, and a lid with openings.
- The metal layers are placed on top surfaces of the package components.
- First metal pins are attached to the metal layers.
- Second metal pins are bonded to the first metal pins using solder.
- A lid with openings is placed over the second metal pins.
Potential Applications
- This semiconductor package with a cooling system can be used in various electronic devices, such as computers, smartphones, and gaming consoles.
- It can be particularly beneficial in high-performance devices that generate a lot of heat.
Problems Solved
- Overheating is a common issue in electronic devices, which can lead to reduced performance and even component failure.
- This technology solves the problem of overheating by providing an effective cooling system for the semiconductor package.
Benefits
- The cooling system helps to maintain optimal operating temperatures for the semiconductor components, ensuring their performance and longevity.
- The use of metal layers and pins improves heat dissipation, enhancing the overall cooling efficiency.
- The encapsulant and lid provide protection to the package components while allowing for effective heat transfer.
Original Abstract Submitted
A semiconductor package including a cooling system and a method of forming are provided. The semiconductor package may include an interposer, one or more package components bonded to the interposer, an encapsulant on the interposer, and a cooling system over the one or more package components. The cooling system may include one or more metal layers on top surfaces of the one or more package components, first metal pins on the one or more metal layers, second metal pins, wherein each of the second metal pins may be bonded to a corresponding one of the first metal pins by solder, and a first lid over the second metal pins, wherein the first lid may include openings.
