17806670. FORMING INTEGRATED ELECTRONIC DEVICES FOR CONVERTING AND DOWNSCALING ALTERNATING CURRENT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
FORMING INTEGRATED ELECTRONIC DEVICES FOR CONVERTING AND DOWNSCALING ALTERNATING CURRENT
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Yen-Ku Lin of Zhubei City (TW)
Ru-Yi Su of Kouhu Township (TW)
Haw-Yun Wu of Zhubei City (TW)
Chun-Lin Tsai of Hsin-Chu (TW)
FORMING INTEGRATED ELECTRONIC DEVICES FOR CONVERTING AND DOWNSCALING ALTERNATING CURRENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 17806670 titled 'FORMING INTEGRATED ELECTRONIC DEVICES FOR CONVERTING AND DOWNSCALING ALTERNATING CURRENT
Simplified Explanation
The patent application describes a method of reducing the chip area and power consumption of a power converter by bonding or integrating a full-bridge device and an LLC device together. This eliminates the need for connecting the devices with wires, saving raw materials and production time. The reduction in parasitic inductance and capacitance also contributes to lower power consumption.
- Bonding or integrating a full-bridge device and an LLC device in a stack or on the same substrate reduces chip area.
- This method reduces power consumption by reducing parasitic inductance and capacitance.
- Connecting the devices eliminates the need for wires, saving raw materials and production time.
Potential Applications
This technology can be applied in various power converter systems, such as:
- Renewable energy systems
- Electric vehicle charging systems
- Industrial power supplies
- Data centers
Problems Solved
The patent application addresses the following problems:
- Large chip area required for power converters
- High power consumption due to parasitic inductance and capacitance
- Raw material and production time wastage in connecting devices with wires
Benefits
The benefits of this technology include:
- Reduced chip area, leading to smaller and more compact power converters
- Lower power consumption, resulting in energy efficiency
- Conservation of raw materials and production time by eliminating the need for wire connections
Original Abstract Submitted
Bonding a full-bridge device and an LLC device in a stack, or forming the full-bridge device and the LLC device on a same substrate, rather than connecting the devices, reduces a chip area associated with a power converter including the full-bridge device and the LLC device. Additionally, the full-bridge device and the LLC device consume less power because parasitic inductance and capacitance are reduced. Additionally, raw materials and production time are conserved that would otherwise have been used to connect the full-bridge device and the LLC device (e.g., via wires).
