18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Methods of Forming Packages and Resulting Structures

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Chien-Fu Tseng of Taipei City (TW)

Yu Chieh Yung of Hsinchu (TW)

Cheng-Hsien Hsieh of Kaohsiung City (TW)

Hung-Pin Chang of New Taipei City (TW)

Li-Han Hsu of Hsinchu (TW)

Wei-Cheng Wu of Hsinchu (TW)

Der-Chyang Yeh of Hsinchu (TW)

Methods of Forming Packages and Resulting Structures - A simplified explanation of the abstract

This abstract first appeared for US patent application 18151758 titled 'Methods of Forming Packages and Resulting Structures

Simplified Explanation

Manufacturing flexibility and efficiency are achieved through a method and resulting structure that allows for the formation and alignment of RDL contact features to through silicon vias (TSV's), regardless of any differences in critical dimensions (CD's) between the manufacturing processes for the TSV's and the contact features.

• The method enables the self-aligned exposure of the underlying TSV's without the need for additional photolithography steps.
• The innovation allows for the formation and alignment of RDL contact features to TSV's, even if there are variations in critical dimensions between the two manufacturing processes.
• The method provides manufacturing flexibility by allowing for the use of different processes for forming TSV's and contact features.
• The resulting structure ensures efficient manufacturing by eliminating the need for additional photolithography steps.

Potential Applications

This technology can be applied in various industries and fields, including:

• Semiconductor manufacturing
• Electronics manufacturing
• Microchip fabrication
• Integrated circuit production

Problems Solved

The technology addresses the following problems:

• Mismatch in critical dimensions between the manufacturing processes for TSV's and contact features
• Inefficiency in manufacturing due to the need for additional photolithography steps
• Lack of flexibility in choosing different processes for forming TSV's and contact features

Benefits

The technology offers several benefits, including:

• Improved manufacturing flexibility by allowing the use of different processes for TSV's and contact features
• Enhanced manufacturing efficiency by eliminating the need for additional photolithography steps
• Cost savings by reducing the complexity of the manufacturing process
• Increased reliability and performance of the resulting structure

Original Abstract Submitted

Manufacturing flexibility and efficiency are obtained with a method, and resulting structure, in which RDL contact features can be formed and aligned to through silicon vias (TSV's) regardless of any potential mismatch in the respective critical dimensions (CD's) between the manufacturing process for forming the TSV's and the manufacturing process for forming the contact features. Various processes for a self-aligned exposure of the underlying TSV's, without the need for additional photolithography steps are provided.