MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

The abstract describes a method for creating a cost-effective collimator structure for contact image sensors that filters out ambient infrared light to reduce noise. The structure includes a dielectric layer, a substrate, a series of via holes, and a conductive layer. The via holes are arranged in an array along the surface of the dielectric layer and extend through both the dielectric layer and the substrate. The conductive layer is applied to the surface of the dielectric layer and the sidewalls of the via holes, allowing the collimator to filter light within a specific range of wavelengths.

The method provides a cost-effective way to fabricate a collimator structure for contact image sensors.
The structure filters out ambient infrared light to reduce noise.
The structure includes a dielectric layer, a substrate, via holes, and a conductive layer.
The via holes are arranged in an array along the surface of the dielectric layer and extend through both the dielectric layer and the substrate.
The conductive layer is applied to the surface of the dielectric layer and the sidewalls of the via holes.
The conductive layer allows the collimator to filter light within a specific range of wavelengths.

Potential Applications

This technology can be applied in various fields where contact image sensors are used, such as:

Document scanning
Barcode scanning
Biometric authentication
Optical character recognition (OCR)
Image processing

Problems Solved

This technology addresses the following problems:

Ambient infrared light causing noise in contact image sensors
Expensive fabrication methods for collimator structures
Inefficient filtering of light in contact image sensors

Benefits

The benefits of this technology include:

Cost-effective fabrication method for collimator structures
Reduction of noise caused by ambient infrared light
Improved filtering of light in contact image sensors
Enhanced performance and accuracy in applications using contact image sensors

Original Abstract Submitted

Disclosed is a cost-effective method to fabricate a multifunctional collimator structure for contact image sensors to filter ambient infrared light to reduce noises. In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; a plurality of via holes; and a conductive layer, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, and wherein the conductive layer is formed over at least one of the following: the first surface of the first dielectric layer and a portion of sidewalls of each of the plurality of via holes, and wherein the conductive layer is configured so as to allow the optical collimator to filter light in a range of wavelengths.

18231760. MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Contents

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

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