17835175. MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Wen-Chuan Tai of Hsinchu City (TW)
Li-Chun Peng of Hsin-Chu City (TW)
Hsiang-Fu Chen of Zhubei City (TW)
Ching-Kai Shen of Zhubei City (TW)
Hung-Wei Liang of New Taipei City (TW)
Jung-Kuo Tu of Hsinchu City (TW)
MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER - A simplified explanation of the abstract
This abstract first appeared for US patent application 17835175 titled 'MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER
Simplified Explanation
The present disclosure describes an integrated chip that includes a semiconductor device substrate and multiple semiconductor devices arranged on it. The chip also includes a micro-electromechanical system (MEMS) layer, which has two moveable masses. A capping layer covers the MEMS layer, with one surface directly over each moveable mass. An outgas layer is present on the surface over the first moveable mass, creating a cavity for it, while the surface over the second moveable mass creates a separate cavity for it.
- Integrated chip with semiconductor devices and a MEMS layer
- MEMS layer includes two moveable masses
- Capping layer covers the MEMS layer
- Outgas layer creates a cavity for the first moveable mass
- Separate cavity is created for the second moveable mass
Potential applications of this technology:
- Micro-electromechanical systems (MEMS) devices
- Sensors and actuators
- Microfluidics and lab-on-a-chip systems
Problems solved by this technology:
- Integration of semiconductor devices and MEMS devices on a single chip
- Providing separate cavities for multiple moveable masses
Benefits of this technology:
- Compact design with integrated functionality
- Improved performance and reliability of MEMS devices
- Cost-effective manufacturing process
Original Abstract Submitted
The present disclosure relates to an integrated chip including a semiconductor device substrate and a plurality of semiconductor devices arranged along the semiconductor device substrate. A micro-electromechanical system (MEMS) layer overlies the semiconductor device substrate. The MEMS layer includes a first moveable mass and a second moveable mass. A capping layer overlies the MEMS layer. The capping layer has a first lower surface directly over the first moveable mass and a second lower surface directly over the second moveable mass. An outgas layer is on the first lower surface and directly between the first pair of sidewalls. A lower surface of the outgas layer delimits a first cavity in which the first moveable mass is arranged. The second lower surface of the capping layer delimits a second cavity in which the second moveable mass is arranged.
