18448110. METHOD OF USING WAFER STAGE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
METHOD OF USING WAFER STAGE
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chih Chien Lin of Hsinchu (TW)
METHOD OF USING WAFER STAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18448110 titled 'METHOD OF USING WAFER STAGE
Simplified Explanation
The patent application describes a method of controlling a wafer stage in semiconductor manufacturing. The method involves moving an immersion hood over different sensors and areas on the wafer stage to perform various tasks.
- The wafer stage is moved to position an immersion hood over a first sensor.
- The wafer stage is then moved to position the immersion hood over a second sensor.
- After that, the wafer stage is moved to position the immersion hood over a first particle capture area on the wafer stage.
- The wafer stage is further moved to define a routing track over the first particle capture area.
- Finally, the wafer stage is moved to position the immersion hood over an area for receiving a wafer on the wafer stage.
Potential applications of this technology:
- Semiconductor manufacturing: This method can be used in the production of semiconductor wafers to control the movement of the wafer stage and perform various tasks accurately and efficiently.
Problems solved by this technology:
- Precise positioning: The method allows for precise positioning of the immersion hood over different sensors and areas on the wafer stage, ensuring accurate measurements and operations.
Benefits of this technology:
- Improved efficiency: By automating the movement of the wafer stage and immersion hood, the method can increase the efficiency of semiconductor manufacturing processes.
- Enhanced accuracy: The precise positioning of the immersion hood over sensors and areas on the wafer stage improves the accuracy of measurements and operations.
- Particle capture: The method includes a particle capture area on the wafer stage, which helps in capturing and removing particles that may affect the quality of the wafer.
Original Abstract Submitted
A method of controlling a wafer stage includes moving the wafer stage to position an immersion hood over a first sensor in the wafer stage. The method further includes moving the wafer stage to position the immersion hood over a second sensor in the wafer stage. The method further includes moving the wafer stage to position the immersion hood over a first particle capture area on the wafer stage after moving the wafer stage to position the immersion hood over the second sensor. The method further includes moving the wafer stage to define a routing track over the first particle capture area. The method further includes moving the wafer stage to position the immersion hood over an area for receiving a wafer on the wafer stage after defining the routing track over the first particle capture area.
