17892846. INTEGRATION OF SOLAR CELL AND IMAGE SENSOR simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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INTEGRATION OF SOLAR CELL AND IMAGE SENSOR

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Feng-Chien Hsieh of Pingtung County (TW)

Yun-Wei Cheng of Taipei City (TW)

Ping Kuan Chang of Hsinchu (TW)

Kuo-Cheng Lee of Tainan City (TW)

Cheng-Ming Wu of Tainan City (TW)

INTEGRATION OF SOLAR CELL AND IMAGE SENSOR - A simplified explanation of the abstract

This abstract first appeared for US patent application 17892846 titled 'INTEGRATION OF SOLAR CELL AND IMAGE SENSOR

Simplified Explanation

The abstract describes an integrated circuit structure that combines a solar cell and an image sensor array. The structure includes multiple photodiodes on a substrate, an interconnect structure, bonding layers, a second substrate, and a transparent conductive oxide layer.

  • The integrated circuit structure combines a solar cell and an image sensor array.
  • The structure includes a substrate with multiple photodiodes.
  • An interconnect structure is placed on the substrate.
  • Bonding layers are added on top of the interconnect structure.
  • A second substrate is placed on the bonding layers.
  • A transparent conductive oxide layer is applied on the second substrate.

Potential applications of this technology:

  • Solar-powered image sensors for various devices and systems.
  • Integration of solar energy harvesting and image sensing capabilities in a single chip.
  • Efficient power generation and image capturing in portable devices like smartphones and cameras.

Problems solved by this technology:

  • Separate solar cells and image sensor arrays require more space and complex integration.
  • Combining both functionalities in a single chip reduces the overall size and complexity of the system.
  • Enables more compact and efficient devices with integrated solar power and image sensing capabilities.

Benefits of this technology:

  • Space-saving integration of solar cells and image sensors.
  • Simplified manufacturing process with fewer components.
  • Enhanced energy efficiency and performance in portable devices.
  • Enables the development of smaller and more versatile devices with integrated solar power and image sensing capabilities.


Original Abstract Submitted

The present disclosure provides an integrated circuit (IC) structure with a solar cell and an image sensor array. An integrated structure according to the present disclosure includes a first substrate including a plurality of photodiodes, an interconnect structure disposed on the first substrate, a first bonding layer disposed on the interconnect structure, a second bonding layer disposed on the first bonding layer, a second substrate disposed on the second bonding layer, and a transparent conductive oxide layer disposed on the second substrate.

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