17838292. METHOD OF FORMING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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METHOD OF FORMING PACKAGE STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Wen-Chih Chiou of Miaoli County (TW)

Yung-Chi Lin of New Taipei City (TW)

Yen-Ming Chen of Hsin-Chu County (TW)

METHOD OF FORMING PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17838292 titled 'METHOD OF FORMING PACKAGE STRUCTURE

Simplified Explanation

The abstract describes a method for bonding a device die to a wafer and forming packages. Here are the key points:

  • The method involves attaching a wafer to a wafer chuck with a curved surface.
  • A device die is placed on the wafer, with its first dielectric layer in contact with the wafer's second dielectric layer.
  • An annealing process is performed to bond the first and second dielectric layers together.
  • The device die is then encapsulated with a material.
  • Redistribution lines are formed, overlapping the encapsulating material and the device die.
  • The encapsulating material is sawed to create multiple packages.

Potential applications of this technology:

  • Semiconductor manufacturing
  • Electronics packaging industry

Problems solved by this technology:

  • Provides a method for bonding device dies to wafers effectively.
  • Enables the formation of multiple packages from a single wafer.

Benefits of this technology:

  • Improved bonding between dielectric layers, ensuring better performance and reliability.
  • Efficient use of wafers, reducing manufacturing costs.
  • Simplified packaging process, enabling mass production.


Original Abstract Submitted

A method includes attaching a wafer to a wafer chuck having a curved surface. The method further includes placing a device die on the wafer, such that a first dielectric layer of the device die is in contact with a second dielectric layer of the wafer, and performing an annealing process to bond the first dielectric layer to the second dielectric layer. The method further includes encapsulating the device die with an encapsulating material, forming redistribution lines overlapping the encapsulating material and the device die, and sawing the encapsulating material to form a plurality of packages.

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